5SGXMA3K2F35C3N

The 5SGXMA3K2F35C3N is a Stratix V GX field programmable gate array offering high on-chip logic and memory capacity for complex digital designs. It delivers 340,000 logic elements and approximately 19.5 Mbits of embedded memory, with up to 600 I/O pins, in a 1152-ball BGA package for surface-mount applications.

Packaged and specified for commercial use, the device targets designs that require large logic arrays, significant embedded RAM, and extensive I/O routing while operating within a commercial temperature range and a narrow core voltage window.

Key Features

• Core Logic — 340,000 logic elements to implement large-scale digital functions and complex logic architectures.
• Embedded Memory — Approximately 19.5 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic blocks.
• I/O Density — 600 available I/O pins to support high-pin-count interfaces and board-level connectivity.
• Power Supply — Core supply range specified at 820 mV to 880 mV for regulated low-voltage core operation.
• Package & Mounting — 1152-ball BGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35); surface-mount mounting.
• Temperature Grade — Commercial grade, with an operating temperature range of 0°C to 85°C.
• Standards & Compliance — RoHS compliant.
• Series Documentation — Stratix V device datasheet provides detailed electrical and switching characteristics for the Stratix V family.

Typical Applications

• High-density digital processing — Implement complex combinational and sequential logic with the large logic element count and abundant embedded RAM.
• High-pin-count interface bridging — Use the 600 I/Os to connect multiple peripherals, FPGAs, or high-channel systems on dense PCBs.
• Prototyping and system integration — Surface-mount 1152-BBGA packaging and broad on-chip resources support advanced prototype and integration efforts within commercial temperature environments.

Unique Advantages

• Substantial on-chip resources — 340,000 logic elements and ~19.5 Mbits of RAM reduce reliance on external logic and memory, simplifying board design.
• High I/O capacity — 600 I/Os provide flexible routing options for multi-interface and multi-channel systems.
• Compact, surface-mount BGA — 1152-ball FCBGA packaging enables high-density PCB implementations while maintaining surface-mount assembly compatibility.
• Defined commercial operating window — Clear specification of commercial temperature range (0°C to 85°C) and core voltage range (820–880 mV) supports predictable thermal and power budgeting.
• RoHS compliant — Meets common lead-free manufacturing and environmental requirements for commercial products.
• Documented electrical characteristics — Stratix V family datasheet includes electrical and switching specifications for design verification and system validation.

Why Choose 5SGXMA3K2F35C3N?

The 5SGXMA3K2F35C3N provides a balance of high logic density, significant embedded memory, and large I/O count in a commercial-grade Stratix V GX FPGA package. Its defined core voltage window and operating temperature range make it suitable for commercial embedded systems and complex digital designs that require predictable electrical and thermal behavior.

This device is appropriate for engineering teams and procurement sourcing FPGAs with substantial on-chip resources, a compact BGA footprint, and documentation coverage from the Stratix V device datasheet to support electrical and switching characterization during design and validation.

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