5SGXMA3K2F35C2N

The 5SGXMA3K2F35C2N is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1152-ball FCBGA package. It provides a large programmable fabric with 340,000 logic elements, approximately 19.46 Mbits of embedded memory, and up to 600 general-purpose I/O pins for dense system designs.

Designed as a commercial-grade device (0 °C to 85 °C), this FPGA targets designs that require high logic capacity, substantial on-chip memory, and extensive I/O integration while operating from a low-voltage core supply of 870 mV to 930 mV.

Key Features

• Programmable Logic Capacity 340,000 logic elements to implement large-scale digital logic and complex custom functions.
• Embedded Memory Approximately 19.46 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive algorithms.
• I/O Density 600 user I/O pins to interface with high-pin-count peripherals and multi-channel systems.
• Package 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35x35) for high pin-count board integration.
• Power Core voltage supply range of 870 mV to 930 mV to match low-voltage system architectures.
• Operating Range Commercial grade operation from 0 °C to 85 °C.
• Mounting Surface-mount device suitable for standard PCB assembly processes.
• Compliance RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• High-density programmable logic Implement complex state machines, datapaths, and control logic using the device’s 340,000 logic elements and abundant on-chip RAM.
• Multi-channel I/O aggregation Aggregate and interface dozens to hundreds of peripherals or channels using up to 600 I/O pins for board-level system integration.
• Memory-centric processing Use approximately 19.46 Mbits of embedded memory for buffering, packet processing, or streaming data tasks that require local storage close to logic.

Unique Advantages

• Large logic fabric: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• High I/O count: 600 I/O pins provide direct connectivity options for complex system-level interfaces without external multiplexing.
• Substantial embedded memory: Approximately 19.46 Mbits of on-chip RAM supports memory-heavy functions and reduces reliance on external memory.
• Compact, high-pin-count package: 1152-ball FCBGA packaging balances pin density with a surface-mount footprint for space-constrained designs.
• Commercial-grade operation: Rated for 0 °C to 85 °C, suitable for a wide range of temperature-controlled environments.
• Regulatory readiness: RoHS compliance simplifies material sourcing and manufacturing approvals.

Why Choose 5SGXMA3K2F35C2N?

The 5SGXMA3K2F35C2N positions itself as a high-capacity Stratix V GX FPGA option for designs that require extensive programmable logic, significant on-chip memory, and large I/O counts in a single surface-mount package. Its commercial-grade rating and low-voltage core supply make it appropriate for systems that operate within standard commercial temperature ranges and low-voltage power architectures.

This part is suitable for engineers and procurement teams looking to consolidate complex digital functions, manage large data flows on-chip, and integrate many external interfaces without expanding board footprint. The combination of logic capacity, embedded RAM, and I/O density offers scalable headroom for future design iterations.

Request a quote or submit a purchase inquiry to get pricing and availability for the 5SGXMA3K2F35C2N Stratix V GX FPGA.