5SGXMA3K2F35C2LG

The 5SGXMA3K2F35C2LG is a Stratix® V GX family FPGA IC from Intel, delivered in a 1152-BBGA (FCBGA) 35 × 35 supplier package. It provides high logic density and on-chip memory alongside a large I/O count, making it suitable for designs that require substantial programmable logic, embedded RAM, and board-level I/O.

Key device parameters include 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, 600 I/Os, a core voltage supply range of 820 mV to 880 mV, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  340,000 logic elements providing substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffering, state storage, and local data processing.
• I/O Density  600 I/O pins to support extensive board-level interfacing and peripheral connectivity.
• High-Speed Transceiver Family  Part of the Stratix V GX family; the family datasheet lists GX channel transceiver speed grades (up to 14.1 Gbps depending on device speed grade).
• Power  Core supply voltage specified between 820 mV and 880 mV for predictable power-domain design.
• Package & Mounting  1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35 × 35); surface-mount device for standard PCB assembly.
• Temperature & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-speed communications and networking  Stratix V GX transceiver speed grades listed in the datasheet support high-bandwidth serial channels, making this device suited for designs requiring high-speed links.
• Compute and signal processing  Large logic capacity and substantial on-chip RAM enable implementation of complex custom logic, DSP pipelines, and hardware accelerators.
• I/O-heavy systems  With 600 I/Os, this FPGA is appropriate for designs that require many parallel interfaces, sensor arrays, or extensive board-level connectivity.

Unique Advantages

• High integration of logic and memory: Combines 340,000 logic elements with approximately 19.456 Mbits of embedded RAM to minimize external component count for many designs.
• Large I/O capability: 600 I/Os simplify board-level routing for multi-peripheral and multi-channel systems.
• High-speed serial support: Belongs to the Stratix V GX family with documented GX channel transceiver speed grades for high-bandwidth link designs.
• Predictable commercial operating range: Rated for 0 °C to 85 °C to match typical commercial embedded systems requirements.
• Standard surface-mount package: 1152-BBGA FCBGA (35 × 35) package supports established PCB assembly processes.
• RoHS compliant: Meets common environmental compliance expectations for modern electronic designs.

Why Choose 5SGXMA3K2F35C2LG?

The 5SGXMA3K2F35C2LG delivers a combination of high logic density, significant on-chip RAM, and extensive I/O in a commercial-grade Stratix V GX FPGA. These characteristics make it suitable for designers who need scalable programmable logic with the option for high-speed serial interfaces and a large number of board-level connections.

Backed by the Stratix V family documentation, the device is a practical choice for systems that require substantial on-chip resources and well-defined electrical characteristics (notably the 820 mV–880 mV core supply window and commercial temperature rating) to support predictable design and integration.

Request a quote or submit an inquiry for pricing and availability of the 5SGXMA3K2F35C2LG to evaluate it for your next design.