5SGXMA3K2F35C2G

The 5SGXMA3K2F35C2G is a Stratix® V GX field programmable gate array (FPGA) in a 1152-BBGA (35×35) package designed for high-density, high-I/O applications. With 340,000 logic elements and approximately 19.5 Mbits of embedded memory, this commercial-grade device targets designs that require large programmable logic capacity, substantial on-chip memory, and extensive I/O connectivity.

Its device-level specifications — including a 600-pin I/O count, broad core supply window, and commercial operating range — make it suitable for demanding digital processing, high-speed I/O, and complex system integration tasks where integration and scalability are priorities.

Key Features

• Core Logic  340,000 logic elements provide significant programmable logic capacity to implement complex combinational and sequential logic functions.
• Logic Array Blocks  128,300 LABs (logic array blocks) for structured logic partitioning and resource planning.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory for many use cases.
• I/O Density  Up to 600 I/O pins to support wide parallel interfaces, numerous peripherals, and multi-lane connectivity requirements.
• Package  1152-BBGA (FCBGA) 35×35 mm supplier package suitable for high-pin-count SMT board designs.
• Power  Core supply voltage range of 870 mV to 930 mV, enabling defined power budgeting at the FPGA core.
• Operating Range  Commercial temperature grade with operating range from 0 °C to 85 °C for standard commercial deployments.
• Mounting  Surface-mount package for modern PCB assembly processes.
• Regulatory  RoHS compliant, supporting lead-free manufacturing requirements.

Typical Applications

• High-density signal processing  Implement complex DSP, data-path, and custom compute pipelines by leveraging large logic capacity and ample embedded memory.
• High-speed serial and parallel I/O  Support multi-lane interfaces and wide parallel buses using up to 600 I/Os for connectivity to transceivers, peripherals, and board-level interfaces.
• Prototyping and system integration  Use the device for advanced prototype builds or integration where high logic count and significant on-chip RAM reduce external component count.

Unique Advantages

• Large programmable fabric: The 340,000 logic elements and 128,300 LABs enable implementation of large, partitioned designs without immediate need for multiple FPGAs.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM reduce reliance on external memory for many buffering and scratchpad requirements.
• Extensive I/O count: 600 I/Os allow flexible interface choices and dense connectivity for high-performance systems.
• Compact, high-pin package: The 1152-BBGA (35×35) package provides many pins in a footprint optimized for SMT assembly on modern boards.
• Commercial readiness: Commercial temperature grade and RoHS compliance enable use in mainstream electronic products and lead-free manufacturing flows.

Why Choose 5SGXMA3K2F35C2G?

The 5SGXMA3K2F35C2G positions itself as a high-capacity Stratix V GX FPGA option for designers needing significant logic resources, abundant on-chip memory, and a large number of I/Os in a single commercial-grade package. Its core voltage range and surface-mount 1152-BBGA package support integration into modern system designs where density and connectivity are primary considerations.

Choose this device when your design requires scalable programmable logic, substantial embedded RAM for local data handling, and the pin-count to support complex board-level interfaces. The combination of these specifications supports robust development and longer-term design scalability within commercial temperature environments.

Request a quote or submit a product inquiry to receive pricing, availability, and ordering information for the 5SGXMA3K2F35C2G.