5SGXMA3K2F35C1N

The 5SGXMA3K2F35C1N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35). It provides a high-density programmable fabric with 340,000 logic elements and approximately 19.46 Mbits of on-chip RAM.

With 600 user I/O pins, a commercial operating temperature range of 0 °C to 85 °C, and a core supply window of 870 mV to 930 mV, this device targets designs that require large logic capacity, substantial embedded memory, and extensive I/O in a compact surface-mount package.

Key Features

• Core Logic  340,000 logic elements for implementing complex digital functions and large-scale custom logic.
• Configurable Logic Blocks  128,300 logic blocks (CLBs) for structured logic partitioning and mapping.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• High I/O Count  600 user I/O pins to accommodate wide parallel interfaces and multiple high-density connections.
• Package & Mounting  1152-BBGA, FCBGA package (supplier 1152-FBGA, 35×35); surface-mount for compact board integration.
• Power  Core voltage supply range from 870 mV to 930 mV for defined power rail design.
• Temperature & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Compliance  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

• High-density digital processing  Large logic capacity and embedded memory make this FPGA suitable for complex custom digital signal processing and algorithm acceleration.
• Networking and communications  Extensive I/O count supports implementation of parallel interfaces, protocol bridging, and multi-lane connectivity.
• Compute acceleration and prototyping  Dense logic and on-chip RAM allow the device to be used for hardware acceleration and system prototyping where compact packaging is required.

Unique Advantages

• High logic density: 340,000 logic elements enable implementation of substantial custom logic blocks without external glue logic.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O availability: 600 I/O pins provide design flexibility for connecting to multiple high-pin-count peripherals and interfaces.
• Compact FCBGA footprint: 1152-ball FCBGA (35×35) package supports high-density board layouts while maintaining a surface-mount form factor.
• Commercial-grade specification: Specified for 0 °C to 85 °C operation, suitable for a wide range of commercial applications.
• RoHS compliance: Conforms to lead-free manufacturing requirements for environmental compliance.

Why Choose 5SGXMA3K2F35C1N?

The 5SGXMA3K2F35C1N combines large logic capacity, significant embedded memory, and a high I/O count in a compact 1152-ball FCBGA package, making it a practical choice for commercial designs that require dense programmable logic and flexible connectivity. Its defined core voltage range and commercial temperature rating simplify power-rail and thermal planning for production systems.

Suitable for design teams building advanced digital processing, networking, or compute-acceleration solutions, this Stratix V GX device provides a balance of integration and board-level density backed by Intel's Stratix family lineage.

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