5SGXMA3K1F40I2N

The 5SGXMA3K1F40I2N is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel designed for high-density, industrial-grade digital integration. It provides 340,000 logic elements and approximately 19.456 Mbits of embedded memory in a high-pin-count FCBGA package, enabling complex system integration in a single device.

This device is specified for industrial temperature operation and a low-voltage core supply, delivering broad I/O capacity and packaging suitable for surface-mount assembly in demanding embedded applications.

Key Features

• Core Logic Capacity  340,000 logic elements for implementing large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, packet processing, and on-chip data storage.
• I/O Density  600 I/O pins to support extensive peripheral and interface connectivity without external multiplexing.
• Power and Voltage  Core voltage supply range of 870 mV to 930 mV for the device core.
• Thermal and Operating Range  Industrial-grade operating temperature from −40 °C to 100 °C for reliably operating in wide-temperature environments.
• Package and Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type for standard PCB assembly.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital integration  Implement large programmable datapaths and custom logic where substantial on-chip logic and memory reduce external component count.
• Multi-interface systems  Support designs that require many parallel or serial interfaces thanks to the device's 600 I/O pins.
• Industrial embedded systems  Deploy in temperature-challenging environments using the device’s industrial operating range and surface-mount FCBGA package.

Unique Advantages

• High logic capacity: 340,000 logic elements allow consolidation of complex functions onto a single FPGA, simplifying board-level design.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 600 I/Os enable direct connection to multiple subsystems and peripherals without additional interface hardware.
• Industrial temperature rating: Specified −40 °C to 100 °C for reliable operation across a wide range of deployment environments.
• Compact, high-density package: 1517-BBGA (FCBGA) / 1517-FBGA (40×40) packaging supports high pin count in a compact surface-mount form factor.
• RoHS compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGXMA3K1F40I2N?

The 5SGXMA3K1F40I2N brings large-scale programmable logic, significant embedded memory, and very high I/O density in an industrial-grade Stratix V GX device. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 600 I/Os makes it well suited for complex, integration-focused designs that benefit from consolidating multiple functions onto a single FPGA.

Packaged in a 1517 FCBGA footprint with surface-mount mounting and specified for −40 °C to 100 °C operation, this device is positioned for engineers and procurement teams targeting robust, high-density FPGA solutions backed by the Stratix V family heritage.

Request a quote or submit a purchase inquiry to receive current pricing and availability for 5SGXMA3K1F40I2N.