5SGXMA3K1F40C2N

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1517-BBGA, FCBGA

Quantity 506 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3K1F40C2N – Stratix V GX FPGA, 340000 logic elements, ~19.46 Mbits RAM, 600 I/Os, 1517-BBGA (FCBGA)

The 5SGXMA3K1F40C2N is a Stratix® V GX field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package, offered as a commercial-grade device. It provides very large programmable logic capacity, substantial embedded RAM, and a high I/O count to address complex, high-density digital designs.

Designed for commercial embedded systems that require significant on-chip logic, memory, and I/O integration, this device’s core specifications support demanding compute, interfacing and high-density integration tasks while operating within defined commercial temperature and supply ranges.

Key Features

  • Core Logic  Approximately 340,000 logic elements to implement large-scale digital designs and complex custom logic.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory dependence.
  • I/O Density  600 user I/Os to support wide parallel interfaces and extensive peripheral connectivity.
  • Package & Mounting  1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting for compact system integration.
  • Power  Core supply range specified at 870 mV to 930 mV to match platform power delivery and enable consistent device operation.
  • Temperature Grade  Commercial operating temperature range of 0 °C to 85 °C for deployment in commercial environments.
  • Compliance  RoHS compliant for environmental and manufacturing conformity.
  • Stratix V GX Family Transceiver Information (Datasheet)  The Stratix V GX device family datasheet lists transceiver speed grades for GX channels (examples include options up to 14.1 Gbps), which are part of the Stratix V GX device characteristics described in the device documentation.

Typical Applications

  • High-density digital processing  Use the large logic count and on-chip RAM for compute-heavy digital signal processing, custom accelerators, and complex control logic.
  • High-throughput communications  Leverage the Stratix V GX family transceiver speed grades listed in the device documentation for designs requiring multi-gigabit serial channels and high I/O bandwidth.
  • Commercial embedded systems  Integrate the FPGA into commercial control, instrumentation, or data-acquisition systems that need substantial I/O and internal memory.
  • Prototyping and system integration  Deploy the device for board- and system-level prototyping where dense logic, abundant I/O, and on-chip RAM reduce external component count.

Unique Advantages

  • High logic capacity: With approximately 340,000 logic elements, the device supports large, complex designs on a single FPGA, reducing the need for multiple devices.
  • Significant embedded memory: Approximately 19.456 Mbits of RAM enables substantial on-chip buffering and data storage, simplifying memory subsystem design.
  • Extensive I/O resources: 600 I/Os provide flexibility to connect to numerous peripherals, interfaces, and parallel buses without external multiplexing.
  • Compact, high-density package: The 1517-BBGA (1517-FBGA, 40×40) FCBGA package allows high pin count integration in a compact footprint for space-constrained designs.
  • Controlled core supply: Specified core supply range of 870 mV–930 mV enables predictable power integration and design margining.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet typical commercial environment requirements.

Why Choose 5SGXMA3K1F40C2N?

The 5SGXMA3K1F40C2N positions itself as a high-density Stratix V GX FPGA option for commercial systems that require substantial logic, embedded memory, and a high I/O count in a compact FCBGA package. Its combination of approximately 340,000 logic elements, roughly 19.456 Mbits of on-chip RAM, and 600 I/Os makes it suitable for designs where integration and on-chip resource density are primary objectives.

Backed by the Stratix V device datasheet and device-level documentation, this FPGA is appropriate for engineers and teams building complex commercial embedded systems, high-throughput communications modules, and advanced prototyping platforms that benefit from a single, highly capable programmable device.

Request a quote or submit an inquiry for pricing and availability of the 5SGXMA3K1F40C2N to begin integrating this Stratix V GX device into your design.

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