5SGXMA3K1F40C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 506 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3K1F40C2N – Stratix V GX FPGA, 340000 logic elements, ~19.46 Mbits RAM, 600 I/Os, 1517-BBGA (FCBGA)
The 5SGXMA3K1F40C2N is a Stratix® V GX field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package, offered as a commercial-grade device. It provides very large programmable logic capacity, substantial embedded RAM, and a high I/O count to address complex, high-density digital designs.
Designed for commercial embedded systems that require significant on-chip logic, memory, and I/O integration, this device’s core specifications support demanding compute, interfacing and high-density integration tasks while operating within defined commercial temperature and supply ranges.
Key Features
- Core Logic Approximately 340,000 logic elements to implement large-scale digital designs and complex custom logic.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory dependence.
- I/O Density 600 user I/Os to support wide parallel interfaces and extensive peripheral connectivity.
- Package & Mounting 1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) with surface-mount mounting for compact system integration.
- Power Core supply range specified at 870 mV to 930 mV to match platform power delivery and enable consistent device operation.
- Temperature Grade Commercial operating temperature range of 0 °C to 85 °C for deployment in commercial environments.
- Compliance RoHS compliant for environmental and manufacturing conformity.
- Stratix V GX Family Transceiver Information (Datasheet) The Stratix V GX device family datasheet lists transceiver speed grades for GX channels (examples include options up to 14.1 Gbps), which are part of the Stratix V GX device characteristics described in the device documentation.
Typical Applications
- High-density digital processing Use the large logic count and on-chip RAM for compute-heavy digital signal processing, custom accelerators, and complex control logic.
- High-throughput communications Leverage the Stratix V GX family transceiver speed grades listed in the device documentation for designs requiring multi-gigabit serial channels and high I/O bandwidth.
- Commercial embedded systems Integrate the FPGA into commercial control, instrumentation, or data-acquisition systems that need substantial I/O and internal memory.
- Prototyping and system integration Deploy the device for board- and system-level prototyping where dense logic, abundant I/O, and on-chip RAM reduce external component count.
Unique Advantages
- High logic capacity: With approximately 340,000 logic elements, the device supports large, complex designs on a single FPGA, reducing the need for multiple devices.
- Significant embedded memory: Approximately 19.456 Mbits of RAM enables substantial on-chip buffering and data storage, simplifying memory subsystem design.
- Extensive I/O resources: 600 I/Os provide flexibility to connect to numerous peripherals, interfaces, and parallel buses without external multiplexing.
- Compact, high-density package: The 1517-BBGA (1517-FBGA, 40×40) FCBGA package allows high pin count integration in a compact footprint for space-constrained designs.
- Controlled core supply: Specified core supply range of 870 mV–930 mV enables predictable power integration and design margining.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet typical commercial environment requirements.
Why Choose 5SGXMA3K1F40C2N?
The 5SGXMA3K1F40C2N positions itself as a high-density Stratix V GX FPGA option for commercial systems that require substantial logic, embedded memory, and a high I/O count in a compact FCBGA package. Its combination of approximately 340,000 logic elements, roughly 19.456 Mbits of on-chip RAM, and 600 I/Os makes it suitable for designs where integration and on-chip resource density are primary objectives.
Backed by the Stratix V device datasheet and device-level documentation, this FPGA is appropriate for engineers and teams building complex commercial embedded systems, high-throughput communications modules, and advanced prototyping platforms that benefit from a single, highly capable programmable device.
Request a quote or submit an inquiry for pricing and availability of the 5SGXMA3K1F40C2N to begin integrating this Stratix V GX device into your design.

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