5SGXMA3K1F40C2G

The 5SGXMA3K1F40C2G is a high-density Stratix® V GX FPGA from Intel, offered in a 1517‑BBGA (FCBGA) package and intended for commercial temperature applications. It provides extensive programmable logic, embedded memory, and a large I/O count for complex digital designs.

As a member of the Stratix V GX family, this device is positioned for applications that require substantial logic capacity, abundant on‑chip RAM, and high I/O integration while operating within a commercial temperature range.

Key Features

• Core Logic  Approximately 340,000 logic elements for implementing large-scale, highly parallel digital functions and custom datapaths.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑intensive algorithms without external DRAM in many designs.
• I/O Density  600 I/O pins to accommodate wide datapaths, multiple interfaces, and system-level integration on a single device.
• Power and Supply  Core supply voltage range from 870 mV to 930 mV, enabling defined power budgeting and voltage planning for board designs.
• Package and Mounting  1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40), designed for surface‑mount assembly.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard commercial deployments.
• Standards and Compliance  RoHS‑compliant construction for regulatory and environmental conformance.
• Family Characteristics  Part of the Stratix V GX family with published device-level electrical and switching characteristics in the device datasheet.

Typical Applications

• High‑performance digital processing  Implement complex signal processing algorithms and wide parallel datapaths using the device’s large logic and memory resources.
• High‑I/O system integration  Use the 600 I/O pins to consolidate multiple interfaces and peripherals on a single FPGA for compact system designs.
• Communication and networking modules  Leverage the Stratix V GX family’s transceiver and switching characteristics (as described in the family datasheet) where high‑speed serial interfaces are required.

Unique Advantages

• Substantial logic capacity: 340,000 logic elements provide headroom for large FPGA designs and complex state machines without partitioning across multiple devices.
• Significant on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for many buffering and real‑time processing tasks.
• High I/O count: 600 I/O pins simplify board-level connectivity and reduce the need for multiple FPGAs to support diverse interfaces.
• Commercial temperature rating: Rated 0 °C to 85 °C to match a wide range of standard commercial deployments and system environments.
• RoHS compliant: Built to meet environmental compliance expectations for modern electronics manufacturing.
• Compact FCBGA package: 1517‑BBGA (1517‑FBGA supplier footprint) enables dense PCB routing and surface‑mount assembly.

Why Choose 5SGXMA3K1F40C2G?

This Stratix V GX FPGA combines very high logic capacity, substantial embedded memory, and a large I/O complement in a commercial‑grade FCBGA package, making it a strong option for systems that require consolidated, high‑density programmable logic. It is well suited to designers who need to implement complex algorithms, high‑bandwidth interfaces, and integrated system functions on a single device.

Backed by the Stratix V family datasheet and Intel’s device documentation, the 5SGXMA3K1F40C2G offers clearly defined electrical and switching characteristics to support design validation, power planning, and system integration for commercial products.

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