5SGXMA3K1F40C1N

The 5SGXMA3K1F40C1N is a Stratix V GX FPGA device from Intel, delivered in a 1517-BBGA FCBGA package for surface-mount applications. It combines high logic capacity with substantial on-chip memory and a large I/O count to address complex digital designs.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 user I/Os, this commercial-grade device is suited for designs that require dense logic implementation, significant embedded RAM, and broad I/O connectivity. The device operates with a core supply range of 870 mV to 930 mV and a commercial temperature rating of 0°C to 85°C.

Key Features

• Core / Logic Capacity  340,000 logic elements and 128,300 LABs provide a high-density resource pool for large, complex logic designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM supports data buffering, FIFOs, and memory-intensive functions.
• I/O Count  600 user I/Os enable extensive external interfacing and board-level connectivity.
• Transceiver Family Capability  Stratix V GX family transceiver speed grades are defined in the device datasheet (series information indicates transceiver grades up to 14.1 Gbps for the family).
• Power / Voltage  Core supply range: 870 mV to 930 mV.
• Package & Mounting  1517-BBGA, FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor.
• Temperature & Grade  Commercial grade device rated for operation from 0°C to 85°C.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic implementations  Deploy the device’s 340,000 logic elements to implement large custom datapaths, control logic, and complex state machines.
• Memory-intensive FPGA functions  Use approximately 19.456 Mbits of embedded RAM for buffering, packet queuing, and on-chip data storage.
• Systems requiring extensive I/O  Take advantage of 600 I/Os for broad sensor arrays, multi-channel interfaces, or dense board-level signal routing.

Unique Advantages

• High logic capacity: 340,000 logic elements enable consolidation of large designs into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM supports local buffering and memory-heavy algorithms without relying on external RAM.
• Extensive I/O connectivity: 600 user I/Os allow flexible interfacing to multiple peripherals, mezzanine cards, or connectors.
• Compact, high-pin-count package: The 1517-BBGA (1517-FBGA, 40×40) package provides a high I/O density in a surface-mount form factor suitable for compact PCBs.
• Defined power window: Core voltage range of 870 mV to 930 mV supports designs that target specific low-voltage core rails.
• Documented family specifications: The Stratix V device datasheet provides electrical, switching, and transceiver guidance for designers working within the Stratix V GX family.

Why Choose 5SGXMA3K1F40C1N?

The 5SGXMA3K1F40C1N positions itself as a high-density, high-connectivity FPGA option within the Stratix V GX family. Its combination of 340,000 logic elements, roughly 19.456 Mbits of embedded RAM, and 600 I/Os makes it appropriate for complex digital designs that demand on-chip resources and broad external interfacing while operating within a commercial temperature range.

Backed by the Stratix V device documentation, this device offers a well-specified platform for engineers needing predictable electrical characteristics (including a defined core supply window and package detail) and RoHS-compliant manufacturing.

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