5SGXMA3K1F35I2N

The 5SGXMA3K1F35I2N is a Stratix® V GX family FPGA offering a high logic capacity and extensive on‑chip memory in a surface‑mount 1152‑BBGA (35×35) package. It is designed for applications that require large programmable logic resources, significant embedded RAM, and a high I/O count within an industrial temperature grade.

With 340,000 logic elements, approximately 19.46 Mbits of embedded memory and 600 I/Os, this device targets designs that need dense logic integration, wide peripheral connectivity, and operation from –40 °C to 100 °C.

Key Features

• Core Logic  340,000 logic elements for implementing complex, high-density programmable logic functions.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage without depending solely on external memory.
• I/O Density  600 general-purpose I/O pins to enable broad system interfacing and connectivity.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match platform power design and rail specifications.
• Package & Mounting  Surface‑mount 1152‑BBGA (supplier device package: 1152‑FBGA, 35×35) for compact, high‑pin‑count board designs.
• Thermal & Grade  Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in temperature‑demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density logic implementations  Leverage 340,000 logic elements to map complex state machines, pipelines, and custom accelerators directly on‑chip.
• On‑chip memory‑centric designs  Use approximately 19.46 Mbits of embedded RAM for large buffers, tables, and data‑path storage without immediate reliance on external DRAM.
• High‑I/O systems  Integrate with numerous peripherals and interfaces using 600 I/Os for dense board‑level connectivity.
• Industrial‑grade deployments  Operate across –40 °C to 100 °C for systems that require wide temperature tolerance.

Unique Advantages

• High logic density: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing board count and interconnect complexity.
• Substantial on‑chip memory: Approximately 19.46 Mbits of embedded RAM supports large internal data storage for buffering and algorithm acceleration.
• Extensive I/O capability: 600 I/Os provide the flexibility to connect numerous peripherals, sensors, and interfaces without external expanders.
• Industrial temperature support: Rated for –40 °C to 100 °C, supporting applications that operate in harsh or temperature‑variable environments.
• Compact, high‑pin package: 1152‑BBGA (35×35) footprint balances high I/O count with manageable PCB area for space‑constrained systems.
• RoHS compliant: Aligns with environmental and regulatory requirements for lead‑free manufacturing.

Why Choose 5SGXMA3K1F35I2N?

The 5SGXMA3K1F35I2N positions itself as a high‑capacity Stratix V GX FPGA option for designs that require a large programmable fabric, significant embedded RAM, and a high number of I/Os within an industrial temperature envelope. Its combination of 340,000 logic elements, approximately 19.46 Mbits of on‑chip memory, and 600 I/Os makes it suitable for engineers consolidating complex logic and data‑path functions onto a single device.

Built in a space‑efficient 1152‑BBGA package and specified for a core supply range of 870–930 mV, this device is aimed at teams who need predictable, verifiable hardware resources and environmental robustness for long‑life deployments.

Request a quote or submit a procurement inquiry for 5SGXMA3K1F35I2N to evaluate availability and pricing for your next design.