5SGXMA3K1F35C2WN

The 5SGXMA3K1F35C2WN is a Stratix V GX field-programmable gate array (FPGA) from Intel, offered in a 1152-BBGA (35×35) FCBGA package for surface-mount applications. This commercial-grade device delivers high logic density and on-chip memory capacity for designs that require substantial programmable resources and large I/O counts.

With 340,000 logic elements and approximately 19.5 Mbits of embedded memory, the device targets high-density digital designs where integration and pin count are key considerations. The device operates over a commercial temperature range and uses a low core voltage supply between 870 mV and 930 mV.

Key Features

• Core logic density  340,000 logic elements provide substantial programmable fabric for complex digital designs.
• Embedded memory  Approximately 19.5 Mbits of on-chip RAM to support large data buffers and state storage.
• I/O capability  Up to 600 user I/Os to accommodate high-pin-count interfaces and multi-channel connectivity.
• Package and mounting  1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount FCBGA format for compact board integration.
• Power  Core supply voltage specified between 870 mV and 930 mV for the device core.
• Temperature and grade  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Standards and documentation  Device is part of the Stratix V GX family and is covered by the Stratix V device datasheet and electrical characteristic documentation.
• RoHS compliance  RoHS-compliant design for regulatory environmental considerations.

Typical Applications

• High-density digital designs  Systems that require up to 340,000 logic elements and significant on-chip RAM for complex combinational and sequential logic.
• High I/O aggregation  Applications needing up to 600 I/Os and a high-pin-count FBGA package for multi-channel interfacing and board-level consolidation.
• Commercial temperature deployments  Devices and systems specified to run in 0 °C to 85 °C environments where commercial-grade components are appropriate.

Unique Advantages

• Large programmable fabric: 340,000 logic elements enable integration of complex functions on a single device, reducing external component count.
• Significant embedded memory: Approximately 19.5 Mbits of RAM supports large data buffering and in-system storage without needing external memory.
• High I/O capacity: 600 user I/Os accommodate diverse interfaces and simplify board routing for multi-channel designs.
• Compact, high-density package: 1152-BBGA (35×35) FCBGA packaging provides a high-pin-count solution in a compact form factor for space-constrained PCBs.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to match common commercial product requirements.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMA3K1F35C2WN?

The 5SGXMA3K1F35C2WN positions itself where high logic density, abundant embedded memory, and large I/O counts are required within commercial-temperature applications. Its Stratix V GX architecture and documented electrical characteristics make it suitable for complex, integrated designs that benefit from a single high-capacity FPGA.

Design teams seeking a commercially graded FPGA with a compact 1152-BBGA package and a low-voltage core rail will find this device aligns with dense, pin-rich board-level implementations while leveraging Stratix V GX family documentation and support for device characterization and integration.

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