5SGXMA3K1F40C1G

The 5SGXMA3K1F40C1G is a Stratix® V GX field programmable gate array (FPGA) from Intel, offered in a 1517-BBGA FCBGA (1517-FBGA, 40×40) surface-mount package. This commercial-grade FPGA integrates a large logic fabric, substantial on-chip memory, and extensive I/O to support complex digital designs and high-density integration.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory and 600 I/O pins, the device is targeted at applications that require significant logic capacity, high I/O counts, and low-voltage core operation.

Key Features

• Core & Logic  340,000 logic elements provide a large programmable fabric for complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support data buffering, large state machines, and memory-hungry logic blocks.
• I/O & Connectivity  600 I/O pins accommodate dense external interfaces and multiple parallel connections to peripherals and subsystems.
• Power and Supply  Core voltage supply range from 870 mV to 930 mV, enabling low-voltage operation consistent with modern FPGA cores.
• Package & Mounting  1517-BBGA, FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
• Operating Conditions & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.
• Series-Level Notes  The Stratix V family datasheet documents a range of transceiver and speed-grade options across the series; refer to Stratix V documentation for series-level transceiver and speed-grade details.

Typical Applications

• High-density digital processing  Large logic capacity and substantial embedded memory make the device suitable for complex custom digital architectures and hardware acceleration.
• Data aggregation and I/O-intensive systems  With 600 I/O pins, the FPGA supports systems requiring many parallel interfaces or large numbers of external connections.
• Prototyping and system integration  The surface-mount 1517-FBGA package and commercial operating range suit development and integration into compact, production-focused boards.

Unique Advantages

• High logic capacity: 340,000 logic elements enable implementation of sizeable custom logic blocks and multi-function designs without external ASICs.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive connectivity: 600 I/O pins provide flexibility to connect numerous peripherals, sensors, or parallel interfaces directly to the FPGA.
• Compact FCBGA package: 1517-FBGA (40×40) surface-mount package conserves PCB area while enabling dense integration.
• Low-voltage core operation: 870 mV to 930 mV supply range aligns with low-power core designs and modern process nodes.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose 5SGXMA3K1F40C1G?

The 5SGXMA3K1F40C1G combines a high logic-element count, substantial embedded memory, and a large I/O complement in a compact FCBGA package, delivering a balanced platform for complex digital designs where integration density and I/O capacity matter. As a Stratix® V GX device from Intel, it aligns with family-level documentation and design resources for developers working with Stratix V architectures.

This part is well suited to engineering teams building high-density, I/O-rich systems that require a commercial-grade FPGA with low-voltage core operation and RoHS compliance. Its specifications support scalable designs and straightforward integration onto compact PCBs.

Request a quote or submit an inquiry for 5SGXMA3K1F40C1G to discuss availability, pricing, and integration details for your next design.