5SGXMA3K1F35I2WN

The 5SGXMA3K1F35I2WN is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1152-FBGA surface-mount package. It combines high core density, substantial embedded memory, and a large I/O count for demanding industrial designs.

This device targets applications that require significant programmable logic and high I/O capacity while operating across an industrial temperature range. It is offered with Stratix V GX family attributes including series transceiver speed-grade options and detailed electrical and I/O switching characteristics.

Key Features

• Core Logic: 340,000 logic elements for complex digital designs and large-scale integration.
• Embedded Memory: Approximately 19.5 Mbits of on-chip RAM to support buffering, packet processing, and large FPGA-based state machines.
• I/O Capacity: 600 I/O pins to accommodate extensive peripheral, bus, and high-density interface requirements.
• Transceiver and Switching Characteristics: Part of the Stratix V GX family, with documented transceiver speed-grade options and comprehensive switching and I/O timing characteristics provided at the device series level.
• Power and Supply: Core voltage supply range from 870 mV to 930 mV to match system power-rail requirements.
• Package & Mounting: 1152-FBGA (35×35) FCBGA, surface-mount package for compact board integration.
• Operating Range & Grade: Industrial temperature grade with an operating temperature range of -40 °C to 100 °C.
• Compliance: RoHS-compliant to meet environmental and manufacturing requirements.

Typical Applications

• High-speed serial communications: Leverages the Stratix V GX series transceiver capability and extensive I/O to implement protocol handling, aggregation, and interface bridging.
• Network and packet-processing appliances: Uses large logic capacity and on-chip RAM for packet buffering, parsing, and custom networking functions.
• Signal processing and accelerators: Provides the logic density and embedded memory needed for DSP pipelines, real-time processing, and hardware acceleration tasks.

Unique Advantages

• High logic density: 340,000 logic elements enable consolidation of multiple functions and deep custom logic implementations, reducing system-level BOM complexity.
• Significant on-chip RAM: Approximately 19.5 Mbits of embedded memory reduce dependence on external memory for buffering and state storage, improving throughput and latency.
• Extensive I/O: 600 I/O pins support dense peripheral connectivity and multi-protocol interface requirements without additional bridging devices.
• Industrial temperature capability: Rated for -40 °C to 100 °C operation for deployment in temperature-challenging environments.
• Compact, manufacturable package: 1152-FBGA (35×35) FCBGA surface-mount package supports high-density PCB layouts and automated assembly.
• Standards-compliant manufacturing: RoHS compliance supports environmentally conscious production and global supply requirements.

Why Choose 5SGXMA3K1F35I2WN?

The 5SGXMA3K1F35I2WN positions itself as a high-density, industrial-grade FPGA for designs that require a combination of large programmable logic resources, substantial on-chip memory, and a high I/O count. Its Stratix V GX family characteristics and documented electrical and transceiver-related specifications make it suitable for systems where deterministic performance and flexibility are critical.

Engineers and procurement teams seeking a scalable FPGA platform with verified operating ranges, compact packaging, and RoHS compliance will find this device well suited for demanding networking, processing, and high-speed interfacing applications.

Request a quote today to receive pricing and availability for the 5SGXMA3K1F35I2WN, or submit a part inquiry to obtain technical and purchasing assistance.