5SGXMA3K1F35C2N

The 5SGXMA3K1F35C2N is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1152‑ball FCBGA package. This commercial‑grade device delivers high logic capacity, large on‑chip memory, and a high I/O count for dense programmable logic designs.

With 340,000 logic elements, approximately 19.46 Mbits of embedded memory, and up to 600 user I/O, the device is suited to applications that require substantial programmable logic resources and significant local RAM in a compact surface‑mount BGA footprint. The device operates from a core supply range of 870 mV to 930 mV and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core Logic Capacity  Provides 340,000 logic elements for implementing complex, high‑density programmable logic functions.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support large buffers, tables, and state storage without external memory.
• High I/O Count  Up to 600 user I/O pins to support wide parallel interfaces and multi‑lane connectivity.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35); surface‑mount mounting type for compact board integration.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power budgeting and supply rails.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial environments.
• RoHS Compliance  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High‑density digital systems  Implements large programmable logic blocks and embedded RAM for complex compute and control tasks where on‑chip resources reduce external component count.
• Multi‑interface aggregation  Supports designs that require many parallel or serialized I/O channels thanks to its 600 I/O pins and compact BGA package.
• Embedded memory‑intensive functions  Ideal for designs that need significant on‑chip buffering, lookup tables, or state machines using approximately 19.46 Mbits of embedded RAM.

Unique Advantages

• Substantial logic density: 340,000 logic elements enable implementation of large, integrated logic subsystems without partitioning across multiple devices.
• Significant on‑chip RAM: Approximately 19.46 Mbits of embedded memory minimizes dependence on external memory and shortens data paths.
• High I/O scalability: 600 user I/O pins provide flexibility for wide buses, parallel interfaces, and dense connectivity in a single device.
• Compact FCBGA footprint: 1152‑ball package (35×35) allows high functionality in a space‑efficient, surface‑mount form factor.
• Commercial operating range: Specified 0 °C to 85 °C operation for standard commercial deployments.
• Regulatory readiness: RoHS compliant for environmentally conscious designs.

Why Choose 5SGXMA3K1F35C2N?

The 5SGXMA3K1F35C2N positions itself as a high‑capacity Stratix® V GX FPGA option that combines large logic resource count, substantial embedded RAM, and extensive I/O in a compact BGA package. Its voltage and temperature specifications make it suitable for commercial designs that demand dense integration and on‑chip memory to reduce BOM complexity.

Engineers designing complex programmable logic systems will find this device appropriate for consolidating functions into a single FPGA, scaling prototype designs, and achieving high integration density while maintaining standard commercial operating parameters and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA3K1F35C2N. Our team can provide technical and procurement support to help evaluate this Stratix® V GX FPGA for your design.