5SGXMA3K1F35C2LN

The 5SGXMA3K1F35C2LN is a Stratix® V GX field programmable gate array (FPGA) from Intel (Altera) that delivers a large logic fabric and substantial on-chip memory in a high-density BGA package. With 340,000 logic elements and approximately 19.456 Mbits of embedded memory, it addresses designs that require high logic capacity, extensive local RAM, and a high I/O count.

Provided as a commercial-grade device (0 °C to 85 °C) and RoHS compliant, this surface-mount FCBGA package offers a compact footprint for high-density board designs while operating at a core supply range of 820 mV to 880 mV.

Key Features

• Core Logic — 340,000 logic elements (logic cells) for large, complex digital designs and high integration density.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM available for buffering, lookup tables, and local storage.
• I/O Density — 600 I/O pins to support wide parallel interfaces and complex external connectivity.
• Package & Mounting — 1152‑BBGA (FCBGA) supplier package 1152‑FBGA (35×35) in a surface-mount form factor for space-constrained PCBs.
• Power — Core supply voltage specified between 820 mV and 880 mV for the device core domain.
• Temperature Grade & Compliance — Commercial grade rated for 0 °C to 85 °C and RoHS compliant for regulatory compatibility.

Typical Applications

• High-density digital systems — Use the large logic capacity and embedded RAM to implement complex FPGA fabrics for compute and control tasks.
• Networking and data path processing — High I/O count and substantial on-chip memory support wide datapath interfaces and packet buffering.
• Prototyping and system integration — Dense logic and memory resources enable consolidation of multiple functions into a single FPGA for board-level prototyping and integration.

Unique Advantages

• High logic capacity: 340,000 logic elements enable consolidation of complex functions onto one device, reducing board-level component count.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM provides ample local storage for buffers, FIFOs, and lookup tables.
• Extensive I/O: 600 I/Os give flexibility for parallel interfaces, memory buses, and peripheral connections without external expansion.
• Compact, manufacturable package: 1152‑BBGA (35×35) FCBGA surface-mount package supports high-density PCB layouts while meeting standard assembly processes.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant for mainstream electronic products and supply-chain requirements.
• Low-voltage core: Core supply specified at 820–880 mV, enabling designs optimized around the device’s core power domain.

Why Choose 5SGXMA3K1F35C2LN?

This Stratix V GX device combines substantial logic and embedded memory with a high I/O count in a compact FCBGA package, offering a compelling option for engineers building dense digital systems, network equipment, or integrated prototypes. Its commercial temperature rating and RoHS compliance make it suitable for mainstream electronic products that require verified FPGA resources and a recognized vendor platform.

Designed for projects that prioritize logic capacity, on-chip memory, and I/O flexibility, the 5SGXMA3K1F35C2LN delivers the resources needed to simplify board-level design and consolidate functions while maintaining clear electrical and thermal operating parameters.

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