5SGXMA3K1F35C2LG

The 5SGXMA3K1F35C2LG is a Stratix V GX family FPGA in a 1152-ball FCBGA package designed for high-density programmable logic applications. It provides a large logic fabric, substantial on-chip memory, and abundant I/O to address complex digital designs that require high integration and configurable hardware acceleration.

As a Stratix V GX device, this part aligns with the electrical and switching characteristics documented for the Stratix V family, and is targeted at commercial-temperature designs requiring a surface-mount, high-pin-count FPGA solution.

Key Features

• High Logic Capacity  Provides 340,000 logic elements for implementing large-scale custom logic, state machines, and datapath blocks.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffers, FIFOs, and fast local storage to support complex algorithms and dataflow.
• Extensive I/O  Up to 600 I/O pins to simplify board-level interfacing with high pin-count requirements and multiple parallel interfaces.
• Package and Mounting  1152-BBGA (FCBGA) package (supplier package: 1152-FBGA 35×35) in a surface-mount form factor for compact PCB footprints and high routing density.
• Power Supply Range  Core voltage supply range of 820 mV to 880 mV to match system power delivery design requirements.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial-environment applications.
• RoHS Compliant  Manufactured in compliance with RoHS environmental requirements.
• Stratix V GX Family Characteristics  Designed in accordance with the Stratix V device electrical and switching specifications, including documented transceiver and I/O timing characteristics in the device datasheet.

Typical Applications

• High‑density FPGA compute  Large programmable logic capacity and embedded memory make this device suitable for compute‑intensive acceleration and custom processing engines.
• High‑pin-count interface hubs  With up to 600 I/Os, the device supports complex multi‑interface bridging and aggregation on a single FPGA.
• Prototyping and system integration  Robust logic and on‑chip RAM enable system prototypes and integration of multiple subsystems into one programmable device.

Unique Advantages

• Large programmable fabric: 340,000 logic elements reduce the need for multiple FPGAs or external glue logic.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM supports buffering and local data storage without external memory dependency.
• High I/O density: 600 I/Os simplify designs that require many parallel data lines or mixed interfaces, lowering BOM complexity.
• Compact, high‑pin package: 1152-BBGA FCBGA packaging delivers high pin count in a compact surface-mount footprint for space-constrained PCBs.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments.
• Standards-compliant manufacturing: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGXMA3K1F35C2LG?

The 5SGXMA3K1F35C2LG combines a very large logic capacity, substantial embedded memory, and extensive I/O in a high‑pin-count FCBGA package, delivering a highly integrated FPGA platform for demanding commercial designs. Its electrical and switching characteristics conform to the Stratix V GX device documentation, offering predictable behavior for system designers.

This part is well suited to engineering teams building large, board‑level FPGA solutions—where consolidation of logic, memory, and I/O into a single device reduces system complexity and BOM count while enabling flexible hardware acceleration and rapid design iteration.

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