5SGXMA3K1F35C2G

The 5SGXMA3K1F35C2G is a Stratix V GX field programmable gate array (FPGA) in a 1152-ball FCBGA package designed for high-density, high-I/O designs. It combines a large logic fabric with substantial on-chip RAM and a high I/O count in a compact surface-mount FBGA footprint, making it suitable for designs that require extensive programmable logic and memory resources while maintaining a compact package profile.

As a commercial-grade Stratix V GX device, this part operates over a 0 °C to 85 °C temperature range and uses a low core supply window (870 mV to 930 mV), enabling integration into a variety of performance-oriented embedded systems that need high logic capacity and significant embedded memory.

Key Features

• Logic Capacity  Approximately 340,000 logic elements; provides substantial programmable logic resources for complex designs.
• Configurable Logic Blocks (CLBs)  128,300 CLBs to structure and organize large logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms without external memory for many functions.
• I/O Density  600 user I/Os to enable wide parallel interfaces and high-pin-count system connectivity.
• Package & Mounting  1152-BBGA (FCBGA) 35×35 mm supplier device package; surface-mount for modern PCB assembly flows.
• Power  Core supply specified from 870 mV to 930 mV to align with low-voltage core domains.
• Temperature Grade  Commercial grade operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic integration  Use the large logic element count and CLB resources to implement complex state machines, accelerators, and custom datapaths.
• Memory-intensive processing  Leverage approximately 19.456 Mbits of embedded RAM for buffering, packet classification, or algorithmic storage without immediate external memory dependence.
• High-pin-count interfaces  Deploy the 600 I/Os for parallel data interfaces, wide buses, or multi-channel front-end connections in communication and processing systems.
• Compact system modules  The 1152-BBGA (35×35) surface-mount package enables integration into densely packed PCBs where board real estate and assembly compatibility are important.

Unique Advantages

• High logic density: Delivers approximately 340,000 logic elements to accommodate large FPGA designs without immediate scaling to larger families.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O capability: 600 I/Os provide flexibility for interfaces, sensors, and multi-channel systems.
• Compact FBGA package: 1152-ball FCBGA (35×35) balances high pin count with a manageable board footprint and surface-mount assembly.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation to match many commercial and enterprise deployment environments.
• RoHS compliant: Aligns with common environmental and manufacturing compliance requirements.

Why Choose 5SGXMA3K1F35C2G?

The 5SGXMA3K1F35C2G positions itself as a high-capacity Stratix V GX FPGA option for designers who need a large programmable fabric, significant embedded RAM, and a high I/O count in a compact FBGA package. Its commercial-grade operating range and low core supply window make it suitable for performance-focused embedded and communications-oriented designs that can leverage dense logic and memory resources.

Backed by the Stratix V device family documentation, this part is appropriate for projects requiring scalability across a proven FPGA series while maintaining predictable electrical and thermal characteristics specified for this device.

Request a quote or submit an inquiry for 5SGXMA3K1F35C2G to obtain pricing and availability for your design requirements.