5SGXMA3K1F35C1G

The 5SGXMA3K1F35C1G is a Stratix® V GX field programmable gate array (FPGA) IC offering very high logic density and extensive I/O capability in a compact FCBGA package. Designed as a commercial‑grade device, it targets designs that require large numbers of programmable logic resources, substantial on‑chip RAM, and broad external connectivity.

Key value propositions include a large logic fabric (approximately 340,000 logic elements), roughly 19.456 Mbits of embedded memory, and up to 600 user I/Os — enabling dense, integrated implementations where configurable hardware performance and high I/O count are required.

Key Features

• Core Logic 
  Approximately 340,000 logic elements to implement complex programmable logic, datapaths, and custom accelerators.
• Embedded Memory 
  Approximately 19.456 Mbits of on‑chip RAM for buffering, FIFOs, and data storage within the FPGA fabric.
• I/O Capability 
  600 I/O pins to support extensive device interfacing and parallel connectivity to peripherals and boards.
• Packaging & Mounting 
  1152‑BBGA FCBGA package (supplier package: 1152‑FBGA 35×35) with surface‑mount compatibility for compact board designs.
• Power 
  Specified voltage supply range from 870 mV to 930 mV for the device supply.
• Temperature & Grade 
  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Compliance 
  RoHS compliant to support lead‑free assembly and regulatory requirements.

Typical Applications

• Custom hardware acceleration 
  Use the large logic element count and embedded memory to implement performance‑optimized datapaths, compression, or encryption engines in hardware.
• I/O‑intensive interface hubs 
  Leverage 600 I/Os to aggregate multiple peripheral interfaces, sensors, or parallel buses in a single programmable device.
• High‑density system integration 
  Deploy in compact boards where a 1152‑BBGA surface‑mount FPGA centralizes multiple functions and reduces external component count.
• Commercial embedded platforms 
  Suitable for commercial‑grade embedded systems that require scalable programmable logic, on‑chip memory, and broad connectivity within 0 °C to 85 °C environments.

Unique Advantages

• High logic density: The approximately 340,000 logic elements enable large, complex designs to be implemented without partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• Extensive I/O: Up to 600 I/Os simplify integration with multiple peripherals and high‑pin‑count systems, minimizing external bridging logic.
• Compact package: 1152‑BBGA (35×35) FCBGA packaging delivers dense integration for space‑constrained PCBs while supporting surface‑mount assembly.
• Commercial suitability: The commercial grade and 0 °C to 85 °C operating range make the device appropriate for a wide range of commercial electronic products.
• RoHS compliance: Supports lead‑free assembly processes and regulatory requirements for commercial electronics.

Why Choose 5SGXMA3K1F35C1G?

The 5SGXMA3K1F35C1G positions itself as a high‑density, commercially graded Stratix V GX FPGA ideal for designs that demand a large programmable fabric, significant embedded memory, and broad I/O capability in a single surface‑mount package. Its specification set helps consolidate multiple functions into one device, reducing overall board complexity and BOM count.

This part is suitable for engineering teams and procurement looking for a scalable, high‑capacity FPGA solution for commercial embedded platforms, I/O‑heavy systems, and applications that benefit from on‑chip memory and dense logic resources. The combination of logic density, memory capacity, and packaging supports long‑term design scalability within the Stratix V GX family.

Request a quote or submit an inquiry for part number 5SGXMA3K1F35C1G to receive pricing, availability, and lead‑time information tailored to your project requirements.