5SGXMA3H3F35I3WN

The 5SGXMA3H3F35I3WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering high logic density and abundant I/O in a BGA package. It integrates a large number of logic elements and on-chip RAM to support complex digital designs that require substantial programmable logic and memory resources.

Built for industrial-grade temperature operation, this device addresses designs that need extensive I/O, significant embedded memory, and a compact surface-mount package for board-level integration.

Key Features

• Core Logic  Approximately 340,000 logic elements for implementing large, complex FPGA designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic functions.
• I/O Density  600 user I/O pins to interface with high-pin-count systems and multiple external devices.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match power-rail planning and system budgeting requirements.
• Package & Mounting  1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35) for compact, high-density board layouts.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C for deployment in industrial environments.
• Standards Compliance  RoHS compliant to meet common environmental and regulatory requirements.

Typical Applications

• High-density digital processing: Implement complex state machines, custom datapaths, and parallel processing where large logic capacity is required.
• Interface aggregation and bridging: Use the high I/O count to aggregate multiple peripherals, sensors, or buses in communication and control systems.
• Memory-centric designs: Deploy on-chip RAM for buffering, packet handling, or streaming data applications that need significant embedded memory resources.
• Industrial control systems: Leverage industrial temperature rating and surface-mount packaging for reliable operation in factory, automation, and instrumentation environments.

Unique Advantages

• High logic capacity: Approximately 340,000 logic elements enable implementation of large FPGA designs without immediate need for external logic expansion.
• Substantial on-chip memory: Nearly 19.456 Mbits of embedded RAM reduces dependency on external memory for many buffering and intermediate storage needs.
• Large I/O complement: 600 I/O pins provide flexibility to connect numerous peripherals, sensors, and high-bandwidth interfaces directly to the FPGA.
• Industrial temperature operation: Rated from −40°C to 100°C for deployment in harsher operating environments where wider temperature tolerance is required.
• Compact, board-friendly package: 1152-BBGA surface-mount package (35×35) supports high-density PCB design while conserving board area.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXMA3H3F35I3WN?

The 5SGXMA3H3F35I3WN combines large logic capacity, sizeable embedded memory, and extensive I/O in a single industrial-grade Stratix V GX FPGA package. It is a strong fit for engineers and procurement teams designing systems that require high-density programmable logic, significant on-chip RAM, and broad interface capability within a compact surface-mount footprint.

This device is appropriate for projects that demand robust operation across a wide temperature range and where reducing board-level component count and external memory dependence are important design goals.

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