5SGXMA3H3F35I3LN

The 5SGXMA3H3F35I3LN is a Stratix® V GX FPGA IC from Intel supplied in a 1152‑BBGA (FCBGA) package (supplier package: 1152‑FBGA, 35×35). It integrates approximately 340,000 logic elements and around 19.5 Mbits of embedded memory to support complex, high‑density designs.

Built for industrial temperature operation, this surface‑mount device provides up to 600 I/Os and operates with a core voltage supply in the 820 mV–880 mV range. The device is RoHS compliant and specified for operation from –40 °C to 100 °C.

Key Features

• Core and Logic  Approximately 340,000 logic elements for high-density logic implementation and large combinational/sequential logic blocks.
• Embedded Memory  Approximately 19.5 Mbits of on-chip RAM for buffering, LUTRAM and data storage closely coupled to the logic fabric.
• I/O Density  Up to 600 programmable I/Os to support wide bus interfaces, parallel peripherals, and multi-channel I/O routing.
• Package and Mounting  1152‑BBGA, FCBGA package (supplier: 1152‑FBGA, 35×35) optimized for surface‑mount assembly and high-pin‑count system integration.
• Power and Voltage  Core supply range of 820 mV to 880 mV for designs targeting low-voltage core operation and predictable power budgeting.
• Temperature and Grade  Industrial grade device rated for operation from –40 °C to 100 °C, suitable for temperature‑sensitive embedded applications.
• Regulatory Compliance  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• High‑density digital processing  Complex logic designs that require large programmable logic capacity and significant on‑chip RAM for intermediate data storage and processing.
• I/O‑intensive system integration  Systems that need extensive external interfacing or parallel connectivity, leveraging the device's up to 600 I/O pins.
• Industrial embedded systems  Deployments that demand industrial temperature range operation and robust, surface‑mount packaging.

Unique Advantages

• High logic and memory density: Enables consolidation of complex functions into a single device, reducing board-level component count.
• Large I/O count: Simplifies integration with multiple peripherals and wide parallel buses without external I/O expanders.
• Industrial temperature rating: Supports systems that require extended temperature operation and reliable field performance.
• Compact high‑pin package: 1152‑BBGA (35×35) footprint balances pin count and board area for dense system layouts.
• Low-voltage core operation: 820 mV–880 mV supply range assists in power budgeting for energy‑conscious designs.
• RoHS compliant: Meets common environmental and manufacturing standards for lead‑free production.

Why Choose 5SGXMA3H3F35I3LN?

The 5SGXMA3H3F35I3LN combines a large logic fabric (approximately 340,000 logic elements) with substantial embedded memory (approximately 19.5 Mbits) and a high I/O count (600) in a compact 1152‑BBGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for demanding embedded designs that require dense integration and reliable operation across a wide temperature range.

This device is well suited for engineering teams designing high‑integration digital systems, I/O‑heavy platforms, or industrial embedded applications that need a balance of logic capacity, memory, and robust packaging.

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