5SGXMA3H3F35I3G

The 5SGXMA3H3F35I3G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel. It delivers a high logic-density FPGA fabric paired with substantial on‑chip RAM and a large I/O count, packaged in a 1152‑FBGA (35×35) surface-mount package.

Designed for applications that require dense logic implementation, abundant embedded memory, and extensive I/O capability in industrial temperature environments, this device provides a balanced combination of capacity and system-level integration.

Key Features

• High Logic Capacity 340,000 logic elements for implementing large-scale combinational and sequential logic networks.
• Embedded Memory Approximately 19.456 Mbits of on‑chip RAM to support large buffers, FIFOs, and block memory requirements.
• Abundant I/O 600 I/O pins to support parallel interfaces, multi-channel connectivity, and rich board-level integration.
• Industrial Temperature Grade Rated for operation from −40°C to 100°C, suitable for industrial environments requiring extended temperature operation.
• Core Voltage Core supply range of 0.820 V to 0.880 V to match target system power rails.
• Package 1152‑BBGA / 1152‑FBGA (35×35) surface-mount package for high‑density PCB placement and reliable soldering.
• Standards Compliance RoHS compliant to meet regulatory requirements for hazardous substance reduction.

Typical Applications

• High‑density computation and acceleration — Leverage the large logic element count and on‑chip RAM to implement compute‑intensive custom accelerators and datapath logic.
• Networking and communications — Use the extensive I/O resources for multi‑lane interfaces and system interconnect tasks that require many physical I/Os.
• Industrial control and automation — Industrial temperature grading and wide operating range make the device suitable for factory automation, motor control logic, and process control systems.
• FPGA‑based prototyping — High logic and memory capacity support complex system prototyping and hardware validation efforts.

Unique Advantages

• High logic density: 340,000 logic elements enable implementation of large, integration‑heavy designs on a single device, reducing system BOM count.
• Significant on‑chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Large I/O complement: 600 I/Os provide flexibility for interfacing with multiple peripherals, parallel buses, and multi‑channel signals without external expanders.
• Industrial readiness: −40°C to 100°C operating range and industrial grade classification support deployment in demanding environmental conditions.
• Compact, manufacturable package: 1152‑FBGA (35×35) surface‑mount package offers a high‑pin count solution compatible with modern PCB assembly processes.
• Regulatory compliance: RoHS compliance supports integration into designs requiring hazardous‑substance conformity.

Why Choose 5SGXMA3H3F35I3G?

5SGXMA3H3F35I3G positions itself as a high‑capacity Stratix V GX FPGA option for designers needing a combination of large logic resources, substantial embedded memory, and a high I/O count within an industrial temperature envelope. Its package and supply‑voltage characteristics make it suitable for dense board designs where on‑chip resources reduce external component needs.

This device is well suited for teams building complex digital systems—such as compute accelerators, communications interfaces, and industrial control platforms—who require scalable logic capacity, robust thermal operating range, and a compact, manufacturable package.

If you would like pricing or lead‑time information, request a quote or submit an RFQ to begin procurement and evaluate how the 5SGXMA3H3F35I3G can meet your project requirements.