5SGXMA3H3F35I3LG

The 5SGXMA3H3F35I3LG is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1152-BBGA (35×35) package and specified for industrial operation. It combines a large logic fabric with substantial embedded memory and a high I/O count to address complex digital designs that require extensive on-chip resources and robust operating-range support.

As a Stratix V GX device, the series provides GX-class transceiver capability in addition to the core FPGA resources; refer to device documentation for transceiver speed grade options. This device is RoHS compliant and rated for surface-mount PCB assembly.

Key Features

• Logic Capacity — 340,000 logic elements (cells) to implement large-scale digital systems and complex algorithms.
• Embedded Memory — Approximately 19.5 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Resources — Up to 600 general-purpose I/Os to support broad interfacing requirements and dense board-level connectivity.
• Transceiver Family — Stratix V GX series transceiver options are available; consult device documentation for supported GX transceiver speed grades and configurations.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for the FPGA core.
• Package and Mounting — 1152-BBGA (FCBGA) package, supplier package listed as 1152-FBGA (35×35); surface-mount mounting type for standard PCB assembly.
• Industrial Temperature — Rated for operation from –40 °C to 100 °C to meet industrial application environments.
• Regulatory Status — RoHS compliant.

Typical Applications

• Industrial Networking — Use the high I/O count and industrial temperature rating for networking equipment and factory automation interfaces.
• High-Density Signal Processing — Leverage 340,000 logic elements and ~19.5 Mbits of embedded memory for filtering, packet processing, and real-time data paths.
• High-Speed Serial Systems — Deploy within systems that require Stratix V GX transceiver options; consult the datasheet for supported transceiver speed grades.
• System Integration — Integrate multiple peripherals and custom logic into a single device to reduce board-level component count and simplify system design.

Unique Advantages

• Substantial Logic Density: 340,000 logic elements enable consolidation of large digital functions into a single FPGA device.
• Significant Embedded Memory: Approximately 19.5 Mbits of on-chip RAM reduces external memory dependency for many buffering and storage needs.
• Extensive I/O Capability: 600 I/Os provide flexibility for dense interfacing and multi-protocol designs.
• Industrial Temperature Rating: –40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact, Surface-Mount Package: 1152-BBGA (35×35) offers a high-pin-count solution while supporting standard surface-mount assembly processes.
• Standards Compliance: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGXMA3H3F35I3LG?

The 5SGXMA3H3F35I3LG positions itself for complex, resource-intensive FPGA applications that require a combination of high logic density, substantial on-chip memory, and wide I/O capability within an industrial temperature envelope. Its Stratix V GX lineage provides access to GX transceiver options and a proven FPGA architecture suited for demanding embedded and communications designs.

This device is well suited for engineering teams and procurement groups looking for a high-capacity FPGA that supports robust system integration, minimizes external component count, and meets industrial operating requirements. For detailed electrical and transceiver parameters, refer to the Stratix V device documentation for speed grade and configuration specifics.

Request a quote or submit a procurement inquiry to obtain pricing, lead time, and availability for part number 5SGXMA3H3F35I3LG.