5SGXMA3H3F35I4G

The 5SGXMA3H3F35I4G is a Stratix® V GX field-programmable gate array (FPGA) in an industrial-grade FCBGA package. It delivers a high logic capacity and significant on-chip RAM with a large I/O count for dense, compute- and I/O-intensive designs.

Provided as a surface-mount 1152-BBGA (35 × 35 mm) device, this FPGA targets applications requiring substantial programmable logic, embedded memory, and broad I/O support while operating across an industrial temperature range.

Key Features

• Core Capacity  Approximately 340,000 logic elements (logic cells) for implementing complex digital logic and system integration.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, packet processing, and data-path storage.
• I/O Density & Package  600 I/Os combined with a 1152-BBGA (FCBGA) 35×35 supplier package; surface-mount mounting type for compact board integration.
• Power  Core voltage supply range from 820 mV to 880 mV to match required power domains.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.
• Stratix V GX family transceiver information (family-level)  The Stratix V device documentation includes GX transceiver speed-grade options (family-level details are available in the Stratix V datasheet).

Typical Applications

• High-speed data communications  Use the device’s high I/O count and family-level transceiver capabilities for network interfaces and data-path implementations.
• Signal processing and acceleration  Leverage the large logic capacity and on-chip RAM for streaming DSP, packet inspection, and hardware acceleration tasks.
• Industrial control and automation  Industrial grade operation and extended temperature range enable deployment in factory automation and process-control systems.
• Prototyping and system integration  High logic density and abundant I/O simplify consolidation of multiple functions into a single programmable device.

Unique Advantages

• High logic density: Approximately 340,000 logic elements allow integration of complex state machines, custom processors, and wide datapaths on a single device.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependency and streamlines data buffering.
• Large I/O complement: 600 I/Os facilitate broad peripheral connectivity and high-pin-count interfaces without external multiplexing.
• Industrial-rated operation: Industrial grade and −40 °C to 100 °C operating range support deployment in harsh ambient conditions.
• Compact FCBGA packaging: 1152-BBGA (35×35) supplier package delivers a high-pin-count solution in a compact surface-mount form factor.
• Low-voltage core: 820–880 mV core supply supports modern low-voltage FPGA power architectures.

Why Choose 5SGXMA3H3F35I4G?

This Stratix® V GX FPGA balances high logic capacity, ample embedded memory, and extensive I/O in an industrial-grade FCBGA package, making it suitable for demanding communications, signal-processing, and industrial applications. The combination of a large logic fabric and on-chip RAM enables designers to consolidate functions and reduce board-level complexity.

For teams building systems that require scalable programmable logic, robust temperature tolerance, and a high I/O count in a compact surface-mount package, the 5SGXMA3H3F35I4G offers a clear, specification-backed option tied to the Stratix V device family documentation.

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