5SGXMA3H3F35I4N

The 5SGXMA3H3F35I4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, designed for complex digital designs that require high logic density, significant on-chip memory, and large I/O capacity. With 340,000 logic elements and approximately 19.456 Mbits of embedded RAM, this device targets systems where integration and board-level consolidation are priorities.

This device is offered in an industrial temperature grade and ships in a high-density 1152‑BBGA FCBGA package suitable for surface-mount assembly. The device supports a core supply range of 820 mV to 880 mV and an operating temperature range of -40°C to 100°C.

Key Features

• Core Logic 340,000 logic elements to support large, complex designs and high levels of functional integration.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM to reduce external memory needs and simplify system architecture.
• I/O Capacity 600 user I/O pins to accommodate high-channel-count interfaces and parallel connectivity.
• Package & Mounting 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) designed for surface‑mount PCB assembly.
• Power Core supply voltage range of 820 mV to 880 mV for core power planning and regulator selection.
• Temperature Grade Industrial operating range from -40°C to 100°C for temperature-demanding deployments.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density FPGA designs For implementations that require hundreds of thousands of logic elements and substantial embedded memory capacity on a single device.
• High I/O systems For boards and subsystems needing up to 600 I/O connections in a compact BGA package.
• Industrial equipment For systems that must operate reliably across an industrial temperature range (-40°C to 100°C).

Unique Advantages

• High logic density: 340,000 logic elements enable consolidation of complex functions and IP into a single FPGA.
• Substantial on-chip memory: Approximately 19.456 Mbits of RAM helps minimize external memory interfaces and board complexity.
• Extensive I/O: 600 I/O pins provide flexibility for parallel data paths, multi-channel interfaces, and board-level connectivity.
• Industrial-ready operation: Rated for -40°C to 100°C, supporting deployment in temperature-challenging environments.
• Low-voltage core: 820–880 mV core supply specification enables targeted power design and efficient regulator selection.
• Manufacturable package: 1152‑BBGA / 1152‑FBGA (35×35) package balances device density with surface-mount assembly requirements.

Why Choose 5SGXMA3H3F35I4N?

The 5SGXMA3H3F35I4N combines high logic capacity, significant embedded RAM, and a large I/O complement in a surface-mount FCBGA package, making it well suited for demanding FPGA implementations that require consolidation and high channel counts. Its industrial temperature rating and RoHS compliance address environmental and regulatory considerations for long-term deployments.

As a member of the Stratix V GX family from Intel, this device is supplied with series-level documentation to support electrical and switching characteristics, aiding system design and validation.

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