5SGXMA3H3F35I3N

The 5SGXMA3H3F35I3N is a Stratix® V GX FPGA in an industrial-grade, surface-mount FCBGA package. It combines high logic capacity and substantial on-chip memory with a high I/O count for designs that require dense programmable logic and extensive connectivity.

Key device parameters include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, support for 600 I/O pins, a low-voltage core supply range of 820 mV to 880 mV, and an operating temperature range of −40°C to 100°C. The device is supplied in a 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35).

Key Features

• Core Logic 340,000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM for data buffering, state machines, and memory-intensive logic functions.
• I/O Capacity 600 I/O pins support broad external device interfacing and high pin-count system requirements.
• Power Core voltage supply specified between 820 mV and 880 mV for the device core power domain.
• Package & Mounting Surface-mount 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35) to support compact board-level integration.
• Temperature & Grade Industrial grade device rated for operation from −40°C to 100°C, suitable for extended-temperature environments.
• Standards Compliance RoHS compliant.

Typical Applications

• Industrial Control and Automation Extended temperature rating and industrial grade construction make the device suitable for control systems and automation equipment requiring robust, programmable logic.
• I/O-Intensive Systems High I/O count enables designs that require numerous external interfaces, sensor arrays, or large peripheral connectivity.
• High-Density Embedded Processing Large logic and embedded memory resources support complex embedded algorithms, signal processing pipelines, and custom hardware accelerators.

Unique Advantages

• High Logic Density: 340,000 logic elements accommodate large, complex designs without immediate need to partition across multiple devices.
• Significant On-Chip Memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependencies for many buffering and state storage needs.
• Extensive I/O: 600 I/O pins simplify integration with multiple peripherals, high-channel-count sensors, and dense connector systems.
• Industrial Temperature Range: Rated from −40°C to 100°C for deployment in environments with wider temperature variations.
• Compact FCBGA Package: 1152-BBGA (1152-FBGA, 35×35) surface-mount form factor enables high-density PCB layout while supporting high pin counts.
• Regulatory Compliance: RoHS compliant to support environmentally conscious manufacturing requirements.

Why Choose 5SGXMA3H3F35I3N?

The 5SGXMA3H3F35I3N offers a combination of large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-grade Stratix V GX FPGA. These attributes make it well suited for designers building feature-rich, high-density programmable systems that must operate across extended temperature ranges.

As part of the Stratix V family, the device provides a clear specification set for power, temperature, package, and I/O that supports repeatable integration into complex electronic systems and long-term design planning.

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