5SGXMA3K1F35C1WN

The 5SGXMA3K1F35C1WN is an Intel Stratix® V GX family Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA (FCBGA) package. It provides very high logic capacity and a large I/O complement for demanding, high-density programmable logic applications.

With 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 600 user I/Os, this commercial‑grade FPGA is aimed at designs that require substantial on-chip resources, broad interfacing capability, and a tightly specified core voltage and operating temperature range.

Key Features

• Core Capacity  340,000 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, packet processing, and resource-rich designs.
• I/O Density  600 user I/Os to support complex multi-channel interfacing and high pin-count designs.
• Power  Core supply voltage specified at 870 mV to 930 mV for the device.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35 × 35 mm) with surface-mount mounting.
• Temperature & Grade  Commercial grade with an operating temperature range of 0°C to 85°C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-Density Digital Systems  Implement large custom logic functions and hardware acceleration using the device's extensive logic element count.
• Multi-Channel I/O and Interface Aggregation  Deploy where many parallel interfaces or protocol conversions are required, leveraging the 600 available I/Os.
• On-Chip Buffering and Packet Processing  Use the substantial embedded RAM to implement buffering, FIFOs, and data-path memory for real-time processing.
• Compact Board-Level Solutions  Integrate a high-capacity FPGA in space-constrained designs using the 1152‑BBGA surface-mount package.

Unique Advantages

• High programmable density: 340,000 logic elements enable complex, feature-rich designs without excessive external logic.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for buffering and data staging.
• Extensive I/O count: 600 user I/Os provide flexibility to connect many peripherals and high-channel-count interfaces directly to the FPGA.
• Compact FCBGA footprint: 1152-BBGA (35 × 35 mm) package supports dense board layouts while keeping the device surface-mount compatible.
• Commercial operating profile: Rated for 0°C to 85°C and RoHS compliant for standard commercial deployments.
• Defined core supply: 870–930 mV core voltage range enables predictable power design and integration with modern power rails.

Why Choose 5SGXMA3K1F35C1WN?

The 5SGXMA3K1F35C1WN delivers a combination of very large logic capacity, substantial embedded memory, and high I/O density in a compact FCBGA package—making it well suited for advanced, high‑resource FPGA designs that require dense logic, on‑chip buffering, and broad interfacing. As a commercial‑grade Stratix V GX device from Intel, it is supported by detailed device documentation for design and electrical characteristics.

This part is appropriate for engineering teams building scalable, resource‑intensive systems that benefit from integrating large amounts of programmable logic and memory into a single surface‑mount FPGA package.

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