5SGXMA3K1F35C1N

The 5SGXMA3K1F35C1N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel. It provides a high-density programmable logic fabric with extensive I/O and embedded memory suitable for designs that require large logic capacity and significant on-chip RAM.

This device targets applications that need a combination of large logic resources, a high count of I/Os, and compact ball-grid packaging while operating within commercial temperature and low-voltage core ranges.

Key Features

• Core Logic  Approximately 340,000 logic elements, enabling large-scale logic integration and complex digital functions on a single device.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM, useful for buffering, FIFOs, and state storage without external memory for many use cases.
• I/O Density  600 I/Os to support extensive external interfaces and parallel connectivity for system-level integration.
• Power and Core Voltage  Core supply range of 870 mV to 930 mV, allowing designers to plan power delivery and thermal budgets accurately.
• Package & Mounting  1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount assembly in space-efficient layouts.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital systems  Leverage the large logic element count to consolidate complex digital functions and custom processing pipelines.
• I/O-intensive platforms  Use the 600 I/Os to interface with multiple peripherals, sensors, or parallel buses in embedded systems and communication equipment.
• On-chip memory centric designs  Employ the approximately 19.46 Mbits of embedded RAM for buffering, data staging, and intermediate storage without immediate reliance on external memory.
• Compact board designs  The 1152-BBGA surface-mount package supports dense PCB implementations where board space is constrained.

Unique Advantages

• High logic capacity: Approximately 340,000 logic elements reduce the need for multiple FPGAs in large designs, simplifying system architecture.
• Substantial embedded memory: Approximately 19.46 Mbits of on-chip RAM helps minimize external memory dependencies and lowers BOM complexity.
• Extensive external connectivity: 600 I/Os provide flexibility for mixed-signal front ends, wide parallel interfaces, and multi-channel system integration.
• Compact, manufacturable package: 1152-BBGA (35×35) FCBGA package enables space-efficient board layouts while supporting surface-mount assembly processes.
• Defined commercial operating range: Rated 0 °C to 85 °C for deployment in standard commercial applications where this temperature window is sufficient.
• RoHS compliant: Facilitates compliance with lead-free manufacturing and environmental regulations.

Why Choose 5SGXMA3K1F35C1N?

The 5SGXMA3K1F35C1N delivers a combination of large logic capacity, significant on-chip RAM, and a high I/O count in a compact 1152-BBGA package, making it well suited for projects that require dense programmable logic and broad external interfacing in a commercial-temperature domain. Its defined core voltage range and RoHS compliance allow engineers to plan power delivery and manufacturing flow with confidence.

This device is appropriate for engineering teams and procurement focused on consolidating functionality, reducing board-level complexity, and leveraging a Stratix V GX device family architecture for scalable FPGA designs.

Request a quote or submit a procurement inquiry to receive pricing, availability, and ordering details for the 5SGXMA3K1F35C1N.