5SGXMA3H3F35C4N

The 5SGXMA3H3F35C4N is a Stratix® V GX family field programmable gate array (FPGA) in a 1152-BBGA (FCBGA) package. It provides a high logic element count and substantial on-chip RAM for designs requiring dense programmable logic and memory integration.

With 600 user I/Os, a supply range of 820 mV to 880 mV, and a commercial operating temperature range of 0 °C to 85 °C, this device targets board-level applications that require significant logic resources and flexible I/O connectivity while meeting RoHS compliance.

Key Features

• Logic Capacity  340,000 logic elements (logic cells) to implement large-scale programmable logic designs.
• Embedded Memory  Approximately 19.456 Mbits of total on-chip RAM for buffering, lookup tables, and data storage inside the FPGA fabric.
• I/O  600 user I/O pins to support dense peripheral, bus, and mezzanine interfaces at the board level.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power-rail requirements.
• Package & Mounting  1152-BBGA (FCBGA) / supplier package 1152-FBGA (35×35) in a surface-mount form factor to support compact, high-density PCB layouts.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for general-purpose electronic applications.
• Regulatory  RoHS compliant.
• Series-level transceiver capability  Stratix V GX family documentation includes transceiver speed grades; refer to series documentation for transceiver options and speed grades available across Stratix V GX devices.

Typical Applications

• Networking & Communications  Large logic capacity and series transceiver options make the device suitable for packet processing, interface bridging, and board-level communications subsystems.
• Signal Processing  Significant on-chip RAM and extensive logic resources enable buffering and real-time processing workloads.
• Prototyping & System Integration  High I/O count and dense logic make the device useful for complex board-level prototypes and integration tasks where many interfaces must converge on a single FPGA.

Unique Advantages

• High logic density: 340,000 logic elements enable complex digital designs without external logic expansion.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT requirements.
• Extensive I/O: 600 I/Os simplify connectivity to multiple peripherals, mezzanine modules, and high-pin-count board interfaces.
• Compact, surface-mount package: 1152-BBGA (35×35) supports dense PCB placement while providing the pin count required by advanced systems.
• Commercial temperature range: Rated 0 °C to 85 °C for mainstream electronic applications.
• RoHS compliant: Meets common environmental compliance expectations for modern electronic manufacturing.

Why Choose 5SGXMA3H3F35C4N?

This Stratix V GX FPGA combines large programmable logic resources with substantial embedded RAM and a high I/O count in a compact surface-mount package, offering a balanced solution for complex, board-level digital systems. It is positioned for designs that need dense logic, significant on-chip memory, and broad interfacing capability within a commercial temperature envelope.

Designers and procurement teams seeking a scalable FPGA platform with strong series-level transceiver options and a high pin-count package will find the 5SGXMA3H3F35C4N appropriate for advanced communication, processing, and integration tasks while maintaining RoHS compliance.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMA3H3F35C4N. Our team can provide delivery lead times and ordering details to support your design schedule.