5SGXMA3H3F35C3N

The 5SGXMA3H3F35C3N is a Stratix V GX family FPGA from Intel, delivered in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package for high-density board integration. It pairs a large programmable fabric with substantial embedded memory and extensive I/O to address complex digital designs.

This device is suitable for designs that require high logic capacity, significant on-chip RAM, and a large I/O count, while operating within a commercial temperature range and a core supply range of 820 mV to 880 mV.

Key Features

• Logic Capacity — 340,000 logic elements and approximately 128,300 logic array blocks provide a high-density programmable fabric for complex logic and datapath implementation.
• Embedded Memory — Approximately 19.5 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions without external devices.
• I/O Resources — 600 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and high-pin-count board designs.
• Power and Core Supply — Core voltage supply range from 820 mV to 880 mV for the device core.
• Package & Mounting — Supplied in a 1152-BBGA (1152-FBGA, 35×35) package optimized for surface-mount assembly and compact, high-density board layouts.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory — RoHS-compliant material and assembly.

Typical Applications

• Networking and Telecom — Large logic density and abundant I/O make the device suitable for packet processing, protocol offload, and line-card functions requiring parallel interfaces.
• Data Processing & Acceleration — Significant embedded RAM and logic element count support hardware acceleration, custom datapaths, and FPGA-based compute kernels.
• Video and Imaging Systems — High I/O count and on-chip memory enable multi-channel video capture, preprocessing, and format conversion tasks.
• High-Pin-Count System Controllers — Use as a system controller on complex PCBs where many external interfaces and programmable logic are required.

Unique Advantages

• High logic density: 340,000 logic elements enable complex algorithms and wide datapaths without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM reduces the need for external memory in many buffering and processing use cases.
• Large I/O footprint: 600 I/O pins support diverse interfacing requirements and dense connector-driven systems.
• Compact BGA package: 1152-FBGA (35×35) allows integration into space-constrained designs while keeping high pin count.
• Commercial-grade operating range: Rated for 0 °C to 85 °C, aligning with a wide array of standard electronic and industrial/commercial deployments.
• RoHS compliant: Conforms to RoHS requirements for lead-free designs and global regulatory needs.

Why Choose 5SGXMA3H3F35C3N?

The 5SGXMA3H3F35C3N offers a balance of high logic capacity, significant embedded memory, and extensive I/O in a compact 1152-FBGA package—making it well suited for designers building complex, high-channel-count systems. Its specified core supply range and commercial temperature grade provide clear electrical and environmental boundaries for system integration.

Designed within the Stratix V GX device family, this FPGA is an appropriate choice for engineering teams that need scalable programmable logic resources and on-chip memory to consolidate functions, reduce PCB BOM, and accelerate time-to-market while maintaining a professional, verifiable specification baseline.

Request a quote or submit a commercial inquiry to obtain pricing, availability, and ordering information for the 5SGXMA3H3F35C3N.