5SGXMA3H3F35C2LN

The 5SGXMA3H3F35C2LN is an Intel Stratix® V GX field programmable gate array (FPGA) packaged in a 1152‑ball BGA (35×35 mm) for high‑density integration. It combines 340,000 logic elements with approximately 19.5 Mbits of embedded RAM and 600 user I/O pins to support designs that require large logic capacity and substantial I/O connectivity.

Designed for commercial temperature environments (0 °C to 85 °C), the device operates with a core voltage supply in the 820 mV to 880 mV range and is RoHS compliant.

Key Features

• Logic Capacity  340,000 logic elements to implement complex digital functions, algorithms, and custom hardware acceleration.
• Embedded Memory  Approximately 19.5 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O Density  600 user I/O pins suitable for wide parallel interfaces, multiple high‑speed lanes, or extensive peripheral connectivity.
• Power Supply  Core voltage supply specified between 820 mV and 880 mV to meet device operating requirements.
• Package and Mounting  1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package for compact, high‑pin‑count PCB integration.
• Operating Temperature  Commercial grade operation across 0 °C to 85 °C.
• Regulatory/Environmental  RoHS compliant.
• Stratix V GX Family Characteristics  Built on the Stratix V GX device family; series documentation provides electrical and transceiver characteristics for GX devices.

Typical Applications

• High‑density digital processing  Implement compute‑intensive logic and custom accelerators using extensive logic elements and embedded RAM.
• Data plane and packet processing  Leverage the high I/O count for parallel interfaces and interconnects in commercial networking and communications equipment.
• Prototype and system integration  Use the 1152‑BBGA package and surface‑mount form factor for compact system prototypes and integration into commercial boards.
• High‑pin‑count control systems  Manage multiple peripherals, sensors, and buses with abundant I/O and on‑chip memory for buffering and control logic.

Unique Advantages

• Large programmable fabric: 340,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing system BOM.
• Substantial embedded RAM: Approximately 19.5 Mbits of on‑chip memory supports data buffering and state machines without external memory dependence.
• High I/O availability: 600 user I/O pins enable extensive interfacing options and simplified board routing for multi‑lane and parallel designs.
• Compact, high‑pin package: 1152‑ball FBGA (35×35 mm) offers a high pin count in a compact footprint for dense board layouts.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial applications and development environments.
• Standards‑aligned family documentation: Stratix V GX family datasheets provide detailed electrical and transceiver characteristics to support system design and validation.

Why Choose 5SGXMA3H3F35C2LN?

The 5SGXMA3H3F35C2LN is positioned for commercial designs that need a high‑capacity FPGA with a large I/O complement and substantial embedded memory. Its combination of 340,000 logic elements, roughly 19.5 Mbits of RAM, and 600 I/O makes it well suited for complex digital processing, data‑plane tasks, and dense system integration where consolidation of functionality into a single FPGA reduces board complexity.

With a compact 1152‑BBGA package and defined operating conditions, this Stratix V GX device delivers a verifiable platform for developers and system integrators focused on performance, integration density, and predictable commercial‑grade operation.

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