5SGXMA3H3F35C3G

The 5SGXMA3H3F35C3G is an Intel Stratix V GX FPGA offered in a commercial temperature grade. It provides a high-density programmable logic fabric with a large embedded memory resource and extensive I/O, enabling complex, configurable digital designs.

Key electrical and mechanical characteristics include a core voltage supply range of 820 mV to 880 mV, surface-mount FCBGA packaging in a 1152-ball FBGA (35 × 35) footprint, and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 340,000 logic elements and 128,300 logic blocks reported for high-density programmable logic integration.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic functions.
• I/O  Up to 600 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power  Core supply voltage specified between 820 mV and 880 mV for the device’s internal logic power domain.
• Package & Mounting  1152-ball FCBGA package (supplier package: 1152-FBGA 35×35) with surface-mount mounting for compact board-level integration.
• Temperature Grade  Commercial grade operation specified from 0 °C to 85 °C.
• Compliance  RoHS compliant, meeting common lead-free environmental requirements.

Typical Applications

• High-density programmable logic  Designs that need large logic capacity and extensive on-chip memory can leverage the device’s approximately 340,000 logic elements and ~19.456 Mbits of RAM.
• Multi-interface systems  Systems requiring many parallel or mixed I/O interfaces can use the device’s 600 I/O pins to consolidate connectivity on a single FPGA.
• Compact board-level integration  The 1152-ball FCBGA (35 × 35) surface-mount package enables dense PCBs and compact system assemblies.

Unique Advantages

• High logic density: The device’s large logic element count enables implementation of complex, resource-intensive designs without immediate migration to multiple devices.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces external memory dependence for buffering and lookup tables.
• Extensive I/O count: 600 I/O pins support wide data paths and numerous peripheral interfaces, simplifying system partitioning.
• Compact FCBGA packaging: The 1152-ball FBGA (35×35) package offers a compact footprint for space-constrained designs while supporting high pin density.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for applications targeting commercial-environment deployments.
• Low-voltage core operation: Core voltage range of 820 mV–880 mV aligned with modern low-voltage power domains.

Why Choose 5SGXMA3H3F35C3G?

Manufactured by Intel as part of the Stratix V GX family, the 5SGXMA3H3F35C3G combines substantial logic capacity, sizable embedded RAM, and a high I/O count in a single commercial-grade FCBGA package. These attributes make it suitable for designs that require dense programmable logic, significant on-chip memory, and consolidated I/O connectivity.

For engineering teams targeting compact, high-capacity FPGA solutions, this device provides a balance of integration and electrical characteristics—such as the low-voltage core supply and RoHS compliance—that support stable, board-level implementation in commercial environments.

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