5SGXMA3H3F35C2N

The 5SGXMA3H3F35C2N is a Stratix V GX family field programmable gate array provided in a 1152-ball fine-pitch BGA (35 × 35 mm) package. It combines a high density of programmable logic with substantial embedded memory and a large I/O count for complex system designs.

With 340,000 logic elements, approximately 19.46 Mbits of on-chip RAM and 600 user I/Os, this commercial-grade device targets designs that require high logic capacity, expansive I/O interfacing, and on-chip memory for buffering and state retention. The device operates at a core supply from 870 mV to 930 mV and is specified for 0 °C to 85 °C operation.

Key Features

• Programmable Logic Capacity  340,000 logic elements for high-density logic implementation and complex FPGA designs.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support large buffering, state machines, and local storage.
• High I/O Count  600 user I/Os to accommodate wide parallel interfaces, multi-port connectivity, and rich board-level integration.
• Transceiver Family (Series)  Part of the Stratix V GX family; Stratix V GX devices support high-speed transceiver channel operation (series datasheet documents transceiver speed grades up to 14.1 Gbps depending on speed grade).
• Power and Supply  Core voltage specified from 870 mV to 930 mV for device operation.
• Package and Mounting  1152-BBGA, FCBGA (1152-FBGA, 35 × 35) surface-mount package for compact, high-pin-count board designs.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation (commercial grade).
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density FPGA designs  Implement complex, large-scale logic functions using the device’s 340,000 logic elements and abundant on-chip memory.
• Multi-interface systems  Use the 600 I/Os to connect multiple parallel buses, sensors, and external peripherals without sacrificing pin availability.
• Buffered data processing  Leverage approximately 19.46 Mbits of embedded RAM for packet buffering, FIFO structures, and local storage in data-path designs.
• Board-level integration  The 1152-ball BGA package allows dense routing and compact placement in space-constrained system boards.

Unique Advantages

• Large programmable fabric: 340,000 logic elements enable implementation of sizeable custom logic and complex state machines without immediate upscaling.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM reduces dependence on external memory for many buffering and temporary-storage needs.
• High I/O density: 600 I/Os allow flexible partitioning of signals and interfaces across multiple subsystems on a single FPGA.
• Commercial-grade operating range: Specified for 0 °C to 85 °C to match many commercial embedded and communications applications.
• Compact high-pin-count package: 1152-ball FCBGA (35 × 35 mm) simplifies board designs that require many connections in a compact footprint.
• RoHS compliance: Supports regulatory and environmental requirements for lead-free designs.

Why Choose 5SGXMA3H3F35C2N?

This Stratix V GX FPGA delivers a combination of high logic density, significant on-chip memory, and a large I/O complement in a single commercial-grade BGA package. It is suited to designers who need substantial programmable resources and I/O flexibility while maintaining a compact board footprint and RoHS compliance.

The device is appropriate for development teams focused on complex data-paths, wide-interface systems, or applications that benefit from on-chip buffering and high logic capacity. Its placement within the Stratix V GX family also aligns it with high-speed transceiver capabilities documented in the series datasheet.

Request a quote or submit an inquiry to obtain pricing, availability, and further technical support for the 5SGXMA3H3F35C2N Stratix V GX FPGA.