5SGXMA3H3F35C2G

The 5SGXMA3H3F35C2G is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152‑BBGA FCBGA package. It delivers a large logic fabric with 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and up to 600 I/Os for high‑density digital designs.

Built for commercial temperature applications, this device targets complex system designs that require extensive logic resources, significant on‑chip memory, and broad I/O integration while operating within a core supply range of 870 mV to 930 mV.

Key Features

• Logic Capacity  340,000 logic elements to implement large combinational and sequential logic networks.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM to support buffers, FIFOs, and state storage for data‑intensive logic.
• I/O Density  Up to 600 I/Os to support extensive peripheral interfacing and multi‑lane connectivity.
• Power and Core Supply  Core voltage supply range of 870 mV to 930 mV to match system power rails and design constraints.
• Package and Mounting  1152‑BBGA FCBGA package (supplier package: 1152‑FBGA (35×35)) with surface‑mount mounting for compact PCB integration.
• Temperature Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial environments.
• RoHS Compliance  RoHS compliant for regulatory and environmental compatibility.
• Stratix V GX Family  Part of the Stratix V GX series; the series documentation details GX transceiver speed grades for high‑speed channel requirements.

Typical Applications

• High‑density digital processing  Use the 340,000 logic elements and embedded memory to implement complex pipelines, accelerators, and datapath logic.
• Large I/O systems  Leverage up to 600 I/Os for multi‑interface systems, multi‑lane connectivity, and extensive peripheral aggregation.
• Memory‑intensive logic  Approximately 19.456 Mbits of on‑chip RAM supports buffering, packet processing, and other memory‑centric functions.

Unique Advantages

• Massive logic resources: 340,000 logic elements provide the capacity to implement large, integrated digital designs without immediate partitioning across multiple devices.
• Significant embedded memory: Approximately 19.456 Mbits of on‑chip RAM reduces reliance on external memory for many buffering and state‑storage needs.
• High I/O count: 600 I/Os enable dense peripheral interfacing and flexible board‑level connectivity options.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, matching standard commercial deployments and system environments.
• Compact package integration: 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package supports high pin‑count integration in space‑constrained layouts.
• Standards‑aware manufacturing: RoHS compliance supports modern environmental and regulatory requirements.

Why Choose 5SGXMA3H3F35C2G?

The 5SGXMA3H3F35C2G combines a large logic fabric, substantial embedded memory, and a high I/O count in a single commercial‑grade Stratix V GX FPGA package. These characteristics make it well suited for system designs that demand integrated digital compute, significant on‑chip buffering, and broad board‑level interfacing within a standard commercial operating range.

As a member of the Stratix V GX family from Intel, the device benefits from the documented architecture and electrical characteristics of the series, enabling designers to align device selection with system power rails, thermal budgets, and board footprint constraints.

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