5SGXMA3H2F35I3LN

The 5SGXMA3H2F35I3LN is an Intel Stratix V GX family FPGA in an industrial-grade FCBGA package. It combines a high-density programmable fabric with a large embedded memory resource and a high I/O count to support complex digital designs and high-speed system integration.

Designed for applications requiring substantial logic capacity and significant on-chip RAM, this device is offered with industrial temperature grading and low-voltage core operation for deployment in environments specified between -40 °C and 100 °C.

Key Features

• Logic Capacity  340,000 logic elements for implementing large, complex logic designs and integration of multiple subsystems on a single device.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, packet storage, and large data structures without external memory.
• I/O Density  600 general-purpose I/O pins to enable broad system connectivity and integration with peripherals and high-pin-count interfaces.
• Operating Voltage  Core supply range of 820 mV to 880 mV to align with low-voltage power domains and system power budgeting.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C for use in industrial environments.
• Package  1152-BBGA, FCBGA format; supplier package listed as 1152-FBGA (35×35) for compact, high-density board designs.
• Mounting Type  Surface mount device suitable for modern PCB assembly processes.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High-speed serial communication systems  High logic capacity and abundant I/O enable implementation of protocol processing, packet handling, and interface bridging for communications equipment.
• High-density compute and acceleration  Large logic and on-chip memory allow consolidation of accelerator functions and custom datapaths within a single FPGA.
• Industrial control and automation  Industrial temperature rating and robust I/O count make the device suitable for control systems, motion control, and factory automation applications.

Unique Advantages

• Large programmable fabric: 340,000 logic elements support highly integrated designs and reduce the need for multiple discrete devices.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM enables large buffering and state storage without external memory overhead.
• High I/O count: 600 I/O pins provide flexibility for complex system routing and multiple peripheral interfaces.
• Industrial operating range: -40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact, high-density package: 1152-BBGA / 1152-FBGA (35×35) package balances I/O capacity with board space efficiency.
• Low-voltage core operation: 820 mV–880 mV supply range aids in power planning for modern low-voltage systems.

Why Choose 5SGXMA3H2F35I3LN?

The 5SGXMA3H2F35I3LN positions itself as a high-capacity Stratix V GX FPGA option for engineers who need extensive logic resources, significant on-chip memory, and a high number of I/Os in an industrial-temperature-rated package. Its specifications suit designs that require consolidation of complex logic and memory-intensive functions while conforming to low-voltage core domains.

Backed by documentation for the Stratix V family, this device is appropriate for teams targeting scalable, robust hardware platforms where integration density and thermal operating range are critical considerations.

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