5SGXMA3H2F35I3G

The 5SGXMA3H2F35I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel/Altera. It delivers high logic density and on-chip embedded memory in a surface-mount 1152-BBGA (1152-FBGA, 35×35) package for industrial-temperature applications.

Built for designs that require large programmable logic capacity, abundant I/O, and configurable high-speed serial capability within the Stratix V GX family, this device is specified with industrial operating temperature and a defined core voltage supply range.

Key Features

• Logic Capacity  Approximately 340,000 logic elements (cells) to implement complex digital designs and custom logic functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and working memory.
• I/O Density  600 I/O pins to support rich peripheral interfacing and multiple parallel interfaces.
• Transceiver Capability (Series)  Stratix V GX family transceiver speed grades support channel rates up to 14.1 Gbps in select speed grades, per Stratix V device documentation.
• Power and Core Supply  Specified core voltage supply range 820 mV to 880 mV for regulated power-domain integration.
• Package & Mounting  1152-BBGA, FCBGA (supplier package 1152-FBGA, 35×35) in a surface-mount configuration for compact PCB layouts.
• Industrial Temperature Grade  Specified operating range −40°C to 100°C for use in industrial-temperature applications.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-speed serial communications  Leverage Stratix V GX family transceiver speed grades (series documentation) for designs that require configurable high-rate serial links.
• Complex digital signal processing  Large logic and embedded RAM capacity support substantial DSP and data-path implementations.
• Multi-interface bridging  High I/O count enables concurrent parallel and serial interfaces for protocol conversion and system aggregation.

Unique Advantages

• Highly integrated logic and memory: Combining approximately 340,000 logic elements with ~19.456 Mbits of embedded RAM reduces external memory dependency and simplifies board partitioning.
• High I/O scalability: 600 I/Os accommodate dense external connectivity without additional interface devices.
• Industrial-temperature robustness: Rated for −40°C to 100°C operation to meet industrial deployment environments.
• Configurable high-speed serial capability: Part of the Stratix V GX family, which includes transceiver speed grades documented up to 14.1 Gbps for appropriate device speed grades.
• Compact FCBGA package: 1152-BBGA (1152-FBGA, 35×35) surface-mount package enables high-density PCB designs while maintaining signal routing efficiency.
• Regulated core voltage range: Defined 820 mV to 880 mV supply range helps align power delivery network design to device requirements.

Why Choose 5SGXMA3H2F35I3G?

This Stratix V GX FPGA balances high programmable logic capacity, substantial embedded memory, and a large I/O footprint in a compact surface-mount FCBGA package. Its industrial temperature rating and specified core voltage range make it suitable for designs that require durability and predictable power-domain planning.

Engineers targeting complex communication, DSP, or multi-interface applications will find the device’s combination of logic density, on-chip RAM, and family-level transceiver capability advantageous. The part is supported within the Intel/Altera Stratix V device documentation for integration and system-level planning.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the 5SGXMA3H2F35I3G.