5SGXMA3H2F35I2LN

The 5SGXMA3H2F35I2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. This industrial-grade device combines high logic density with abundant I/O and embedded memory, delivered in a 1152-BBGA (35 × 35 mm) FCBGA package.

Targeted at designs that require large programmable logic capacity and high-speed serial capability, the device provides a platform for complex digital signal processing, system integration, and transceiver-enabled applications where substantial on-chip resources and industrial temperature operation are required.

Key Features

• Core Logic  340,000 logic elements provide substantial programmable logic capacity for large-scale designs and complex state machines.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• I/O Density  600 user I/Os available for broad system interfacing and high-pin-count connectivity.
• Transceiver Capability (Series)  Stratix V GX family transceiver specifications are documented in the device series datasheet and support high-speed serial channel operation (series-level details included in the Stratix V GX documentation).
• Power and Voltage  Core supply operating range of 820 mV to 880 mV, enabling defined core voltage management within the specified window.
• Package and Mounting  1152-BBGA (supplier package listed as 1152-FBGA, 35 × 35 mm) in a surface-mount format suitable for compact, high-density board designs.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, supporting industrial-environment deployments.
• Compliance  RoHS compliant to meet common environmental and assembly requirements.

Typical Applications

• High-speed serial systems  Leverages the Stratix V GX family transceiver capability for designs requiring high-bandwidth serial links and SERDES-based interfaces.
• Telecommunications and networking  High logic capacity and large I/O counts support packet processing, protocol bridging, and custom switching logic.
• Signal processing and compute acceleration  On-chip RAM and extensive logic enable buffering and pipelined DSP implementations.
• Industrial systems  Industrial temperature rating and surface-mount package fit industrial control, instrumentation, and communications equipment.

Unique Advantages

• High logic density: 340,000 logic elements enable integration of complex functions on a single device, reducing BOM and board area.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM supports deep buffering and local data storage without external memory in many use cases.
• Extensive I/O support: 600 I/Os provide flexible external interfacing for multi-channel systems and high-pin-count connectivity.
• Industrial robustness: Rated for –40 °C to 100 °C operation to meet environmental requirements for industrial deployments.
• Compact BGA package: 1152-BBGA (35 × 35 mm) allows dense PCB integration while keeping high I/O and routing density.
• Vendor-backed Stratix V family: Part of the Stratix V GX family with published device documentation and electrical characteristics in the series datasheet.

Why Choose 5SGXMA3H2F35I2LN?

The 5SGXMA3H2F35I2LN delivers a balance of high logic capacity, substantial on-chip memory, and plentiful I/O in an industrial-temperature, surface-mount BGA package. Its core voltage range and series-level transceiver capabilities make it suitable for designs that require controlled power domains and high-speed serial interfaces.

This device is well suited for engineering teams building complex digital systems, high-bandwidth communications equipment, and industrial processing platforms that require a scalable FPGA solution backed by Intel's Stratix V device documentation.

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