5SGXMA3H2F35C3WN

The 5SGXMA3H2F35C3WN is a Stratix V GX family FPGA in a 1152-BBGA (35×35) FCBGA surface-mount package, offered in a commercial temperature grade. It combines high logic density, substantial on-chip RAM, and a large I/O count to address complex, high-density digital designs.

Key attributes include 340,000 logic element cells, approximately 19.46 Mbits of embedded memory, and 600 available I/O signals, along with a core voltage supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core and Logic Density  Provides 340,000 logic element cells to implement large, complex logic functions and state machines.
• Embedded Memory  Includes approximately 19.46 Mbits of on-chip RAM for buffering, look-up tables, and local data storage.
• I/O and Packaging  Up to 600 I/O pins in a 1152-BBGA (35×35) FCBGA package, optimized for high pin-count board integration and surface-mount assembly.
• Power and Core Voltage  Core supply voltage specified from 820 mV to 880 mV to match targeted power domains and regulator designs.
• Commercial Temperature Grade  Rated for operation over 0 °C to 85 °C, designated as a commercial-grade device for mainstream embedded and communications applications.
• Series-Level Transceiver Options  Stratix V GX devices are offered with transceiver speed grades at the series level, including GX channel options documented in the device family specification.
• Regulatory Compliance  RoHS compliant for lead-free design and manufacturing workflows.

Typical Applications

• High-density digital systems  Leverage the large logic element count and substantial on-chip RAM for complex control logic, protocol engines, and custom accelerators.
• High I/O aggregation  Use the 600 I/O capability for systems requiring numerous interfaces, parallel data paths, or board-level signal routing consolidation.
• Commercial embedded solutions  Suitable for commercial temperature-range embedded products that require a balance of density, memory, and I/O integration.
• Transceiver-enabled designs  Applicable for designs that require the Stratix V GX family’s documented transceiver speed grade options at the series level.

Unique Advantages

• High logic capacity: 340,000 logic element cells enable implementation of large, integrated digital functions without external logic.
• Significant on-chip RAM: Approximately 19.46 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 600 I/Os facilitate complex board-level interfacing and multiple peripheral connections from a single FPGA device.
• Compact, production-ready package: 1152-BBGA (35×35) FCBGA surface-mount package supports high-density PCB layouts and standard assembly processes.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant to meet commercial product requirements and manufacturing standards.

Why Choose 5SGXMA3H2F35C3WN?

The 5SGXMA3H2F35C3WN positions itself where high logic density, substantial embedded memory, and a large I/O count are required in a commercial-grade FPGA. Its combination of 340,000 logic element cells, roughly 19.46 Mbits of on-chip RAM, and 600 I/Os in a 1152-BBGA package makes it well suited to designers building complex digital systems with dense interfacing requirements.

As a member of the Stratix V GX family, the device aligns with the documented series capabilities for transceiver options and device-level electrical and switching characteristics, providing a documented foundation for integration into high-density commercial designs.

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