5SGXMA3H2F35C3G

The 5SGXMA3H2F35C3G is a Stratix® V GX field programmable gate array (FPGA) in a 1152‑ball BGA package. It provides a large programmable logic fabric—340,000 logic elements—and extensive I/O capability to support complex, high‑density programmable logic designs.

With approximately 19.46 Mbits of embedded memory and up to 600 user I/Os, this surface‑mount commercial‑grade device is intended for applications that require significant on‑chip memory, dense logic packing, and broad external connectivity while operating within a 0 °C to 85 °C range.

Key Features

• Logic Capacity  340,000 logic elements provide a high level of integration for large FPGA designs and complex custom logic implementations.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support large buffers, FIFOs, and state storage without external memory in many use cases.
• I/O Density  Up to 600 user I/Os enable broad connectivity for parallel interfaces, multi‑lane signaling, and large peripheral sets.
• Power and Core Supply  Core voltage supply range specified at 820 mV to 880 mV to match system power delivery requirements.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35 × 35 mm) in a surface‑mount form factor for PCB assembly.
• Operating Range & Grade  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead‑free assemblies.

Typical Applications

• High‑density programmable logic designs  Large logic capacity and abundant I/O make this device suitable for consolidated FPGA implementations that replace multiple discrete components.
• On‑chip memory intensive functions  Approximately 19.46 Mbits of embedded RAM supports designs requiring significant internal buffering, packet staging, or data‑plane state storage.
• Multi‑interface systems  The high I/O count is well suited to systems that require many parallel interfaces, wide buses, or numerous peripheral connections.

Unique Advantages

• High logic integration: 340,000 logic elements reduce the need for external glue logic and simplify system architecture.
• Substantial on‑chip RAM: Approximately 19.46 Mbits of embedded memory enables larger internal datasets and lowers dependence on external memory.
• Extensive I/O availability: Up to 600 I/Os provide flexibility for interface routing and system partitioning on a single device.
• Compact BGA footprint: 1152‑ball FCBGA packaging balances high pin count with a compact 35 × 35 mm supplier package for dense PCB designs.
• Commercial temperature grade: Designed for standard commercial environments with a 0 °C to 85 °C operating range.
• RoHS compliant: Supports lead‑free manufacturing and environmental compliance requirements.

Why Choose 5SGXMA3H2F35C3G?

The 5SGXMA3H2F35C3G combines a very large logic resource, significant embedded memory, and a high I/O count in a BGA surface‑mount package—providing a highly integrated platform for complex programmable logic systems. Its commercial temperature grade and RoHS compliance make it appropriate for a wide range of standard industrial and commercial electronic products that require consolidation of logic and memory functions.

This FPGA is suited to designers targeting high‑capacity, multi‑interface systems who need predictable core supply requirements (820 mV–880 mV) and a compact, high‑pin‑count package option for dense PCB layouts.

Request a quote or submit a sales inquiry to receive pricing, availability, and lead‑time information for part number 5SGXMA3H2F35C3G.