5SGXMA3H2F35C2LN

The 5SGXMA3H2F35C2LN is a Stratix V GX family FPGA offered in a 1152-BBGA (35 × 35 mm) FCBGA package for surface-mount applications. It provides a high-density, programmable logic fabric with a large complement of I/O and embedded memory for demanding digital designs.

Designed for commercial-temperature deployments (0 °C to 85 °C) and RoHS-compliant, this device targets applications that require substantial programmable logic resources, extensive I/O connectivity, and on-chip RAM capacity within a compact BGA package.

Key Features

• Logic Capacity — 340,000 logic elements enable large-scale integration of custom digital functions and complex processing pipelines.
• Embedded Memory — Approximately 19.5 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage for real-time processing.
• I/O Count — 600 I/O pins provide broad external connectivity for parallel interfaces, control signals, and high-pin-count designs.
• Package & Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35 × 35 mm) in a surface-mount format for board-level integration.
• Power — Core supply voltage range of 820 mV to 880 mV, matching Stratix V core power requirements.
• Temperature Grade — Commercial grade operation from 0 °C to 85 °C for standard commercial deployments.
• Standards & Compliance — RoHS-compliant to meet environmental directive requirements.
• Stratix V GX Family Characteristics — Per the device family datasheet, Stratix V GX devices include high-performance transceiver capabilities and multiple core/transceiver speed grade options.

Typical Applications

• High-density digital processing — Use the large logic and memory resources for FPGA-based signal processing, packet processing, or protocol implementation.
• Network and communications — Leverage the device’s I/O count and Stratix V GX transceiver family characteristics for high-throughput interface and bridging tasks.
• Compute acceleration — Implement custom hardware accelerators and data-paths that benefit from abundant logic elements and on-chip RAM.
• Board-level integration — The 1152-BBGA package and surface-mount mounting type suit compact, high-density PCB designs.

Unique Advantages

• Large programmable fabric — 340,000 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Substantial on-chip memory — Approximately 19.5 Mbits of embedded RAM supports local buffering and hierarchy-reducing external memory traffic.
• High I/O density — 600 I/Os simplify connectivity to multiple peripherals, parallel buses, and high-pin-count interfaces.
• Compact BGA package — 1152-FBGA (35 × 35 mm) enables high-density board layouts while maintaining a robust mechanical footprint for surface-mount assembly.
• Commercial temperature rating — Rated for 0 °C to 85 °C operation to match standard commercial deployment environments.
• Environmentally compliant — RoHS compliance supports regulatory and sustainability requirements for commercial products.

Why Choose 5SGXMA3H2F35C2LN?

The 5SGXMA3H2F35C2LN combines a high logic element count, significant embedded RAM, and a large I/O complement in a compact 1152-BBGA package, making it well suited for complex commercial FPGA designs that demand integration and connectivity. Its Stratix V GX family characteristics and documented device datasheet details provide engineers with a clear technical foundation for performance-oriented designs.

This device is appropriate for teams building high-density digital processing, compute acceleration, or communication interface solutions that require scalable programmable logic, on-chip memory, and a large I/O footprint in a surface-mount BGA format.

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