5SGXMA3H2F35C1N

The 5SGXMA3H2F35C1N is a Stratix V GX field programmable gate array delivered in a high-density FBGA/BBGA package. It provides extensive programmable logic, on‑chip memory, and a high I/O count for complex digital and system‑level integration.

Designed as a commercial‑grade device, this part targets applications that require large logic capacity, substantial embedded RAM, and broad I/O resources while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity  340,000 logic elements for large, partitionable programmable logic designs.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support data buffering, FIFOs, and on‑device storage.
• I/O  600 user I/Os to accommodate wide datapaths, parallel interfaces, and board‑level connectivity.
• Power Supply  Operates from a core supply range of 870 mV to 930 mV, enabling defined core power budgeting.
• Package & Mounting  Available in a 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface‑mount construction supports standard assembly processes.
• Thermal Grade  Commercial temperature rating with specified operating range 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory adherence in commercial electronics production.

Typical Applications

• High‑density programmable logic  Implement large custom logic functions and state machines using the device's 340,000 logic elements and abundant embedded RAM.
• Data buffering and on‑chip storage  Use the approximately 19.46 Mbits of RAM for packet buffering, FIFOs, and intermediate data storage in complex data paths.
• High‑I/O system integration  The 600 I/Os support wide external interfaces, parallel buses, and board‑level peripheral connectivity.
• Transceiver‑enabled designs  As a Stratix V GX family device, it is suited for designs that leverage the family’s transceiver and I/O capabilities described in the device series documentation.

Unique Advantages

• Large on‑device logic  Substantial logic element count reduces reliance on external processors or glue logic for complex algorithms.
• Significant embedded RAM  Nearly 20 Mbits of on‑chip memory enables high‑throughput buffering and state storage without external DRAM.
• High I/O density  600 I/Os simplify board routing by consolidating multiple interfaces directly to the FPGA.
• Commercial temperature and RoHS compliance  Clear commercial temperature rating and RoHS status support mainstream electronics manufacturing and deployment.
• Compact, surface‑mount packaging  1152‑FBGA/BBGA packaging provides high‑pin count in a space‑efficient footprint for dense system designs.

Why Choose 5SGXMA3H2F35C1N?

This Stratix V GX device combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a commercial‑grade, surface‑mount package. It is well suited for engineers building complex digital systems that require on‑chip resources for performance and integration.

For teams prioritizing scalability and density, the 5SGXMA3H2F35C1N offers a verifiable specification set—logic elements, embedded RAM, I/O count, supply range, and package details—that supports robust system design and predictable integration into commercial product lines.

Request a quote or submit your procurement inquiry to receive pricing and availability for part number 5SGXMA3H2F35C1N.