5SGXMA3H1F35I2G

The 5SGXMA3H1F35I2G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel designed for industrial-grade applications. It combines a high-density programmable fabric with substantial on-chip memory and a large I/O count to support complex, I/O‑rich designs that require industrial operating ranges and precise core voltage control.

Key Features

• Logic Fabric  340,000 logic elements for implementing complex digital logic, custom datapaths, and large-scale state machines.
• Embedded Memory  Approximately 19.46 Mbits of total on-chip RAM (19,456,000 bits) to support buffering, FIFOs, and local data storage.
• I/O Capacity  600 user I/O pins to connect to parallel buses, external peripherals, and board-level interfaces.
• Power and Core Voltage  Specified core supply range of 870 mV to 930 mV to meet device operating requirements.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting  1152‑BBGA (FCBGA) package, supplier package listed as 1152‑FBGA (35×35), designed for surface-mount assembly.

Typical Applications

• High-speed serial communications  Stratix V GX family transceiver speed grades are documented in the device datasheet, enabling designs that require multi-gigabit channel support.
• I/O‑intensive industrial control  Large I/O count (600) combined with an industrial temperature rating makes this FPGA suitable for complex control systems and automation equipment.
• Large‑scale logic and memory integration  High logic element count and approximately 19.46 Mbits of embedded RAM allow consolidation of multiple functions into a single device to reduce system complexity.

Unique Advantages

• High integration density: 340,000 logic elements enable consolidation of substantial logic resources on a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM supports data buffering and intermediate storage without relying solely on external memory.
• Robust I/O capability: 600 I/Os provide flexibility for connecting multiple peripherals, parallel interfaces, and system-level signals.
• Industrial ready: Rated for –40 °C to 100 °C operation to meet the environmental demands of industrial applications.
• Controlled core supply: Narrow voltage supply window (870 mV to 930 mV) supports consistent core operation and predictable power design.
• Board-level convenience: 1152‑BBGA FCBGA surface-mount package (35×35) supports standard assembly processes for compact, high-density board designs.

Why Choose 5SGXMA3H1F35I2G?

The 5SGXMA3H1F35I2G positions itself as a high-density, industrial‑grade Stratix V GX FPGA option that brings substantial logic capacity, significant embedded memory, and broad I/O resources into a single 1152‑BBGA package. Its specified operating temperature range and defined core voltage window make it suitable for demanding embedded and control environments where environmental robustness and precise power design are important.

Backed by Intel's Stratix V device documentation, this device is suited to engineers who need to integrate large digital systems, support multi-gigabit channel families (as described in the Stratix V GX device series documentation), and deploy solutions in industrial settings while maintaining compact board-level implementation.

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