5SGXMA3H1F35C2LG

The 5SGXMA3H1F35C2LG is a Stratix® V GX FPGA in a 1152-BBGA FCBGA package designed for high-density programmable logic designs. It delivers a large logic fabric and substantial on-chip RAM combined with a high pin count to support complex system integration in commercial applications.

Targeted at designs that require extensive logic resources, abundant embedded memory, and many I/O channels, this device provides a compact, surface-mount FPGA solution with defined operating and power envelopes for predictable integration.

Key Features

• Logic Capacity  340,000 logic elements for implementing large-scale digital designs and custom processing pipelines.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support frame buffering, FIFOs, and state storage without external memory.
• I/O Resources  600 device I/O pins to accommodate wide parallel interfaces, multiple peripherals, and high-pin-count system interconnects.
• Power Supply  Core supply range of 820 mV to 880 mV for the programmable core domain.
• Package & Mounting  1152-BBGA (FCBGA) 35×35 package in a surface-mount form factor for dense board integration.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard commercial deployments.
• Regulatory  RoHS compliant.

Typical Applications

• Networking & Infrastructure  Implement packet processing, protocol offload, and custom switching logic using the device’s large logic capacity and high I/O count.
• High-density Signal Processing  Use embedded RAM and abundant logic elements for real-time buffering, DSP pipelines, and data aggregation.
• Advanced Prototyping & System Integration  Integrate wide bus interfaces and complex control logic on a single FPGA for prototype validation or production systems.

Unique Advantages

• Substantial Logic Resources: 340,000 logic elements enable consolidation of multiple functions into a single device, reducing external components.
• Significant On-chip Memory: Approximately 19.456 Mbits of embedded RAM supports internal buffering and state retention without immediate reliance on external memory.
• High I/O Density: 600 I/Os provide flexibility for interfacing to wide parallel buses, multiple transceivers, or numerous peripherals.
• Compact BGA Packaging: 1152-BBGA (35×35) FCBGA provides a high-pin-count solution in a compact surface-mount footprint for space-constrained boards.
• predictable commercial operation: Defined operating temperature (0 °C to 85 °C) and supply range (820–880 mV) support stable integration into commercial products.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious product designs.

Why Choose 5SGXMA3H1F35C2LG?

The 5SGXMA3H1F35C2LG combines a large programmable fabric with substantial embedded RAM and a high I/O count in a compact surface-mount BBGA package, making it suitable for commercial designs that demand integration of complex, high-density logic and memory functions. Its defined voltage and temperature envelopes help streamline power-supply and thermal planning during system design.

This device is well suited for engineering teams developing network, signal processing, and system-integration applications that require scalable logic capacity and flexible interfacing while maintaining RoHS compliance and commercial-grade operating conditions.

Request a quote or submit an inquiry to receive pricing, availability, and additional integration details for the 5SGXMA3H1F35C2LG.