5SGXMA3H1F35C1G

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA

Quantity 312 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3H1F35C1G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA3H1F35C1G is a Stratix V GX family FPGA in a 1152-BBGA FCBGA package, optimized for high-density programmable logic and extensive I/O integration. With a large logic fabric, substantial on‑chip RAM, and support for high-speed transceiver grades in the Stratix V GX series, this commercial-grade device targets demanding digital designs that require heavy compute and high I/O counts.

Key value propositions include high logic capacity, abundant embedded memory, broad I/O availability, and commercial temperature operation for mainstream embedded and communications applications.

Key Features

  • Logic Capacity  Approximately 340,000 logic elements, providing capacity for large-scale digital designs and complex custom logic.
  • Embedded Memory  Approximately 19.46 Mbits of on-chip RAM, enabling high-bandwidth buffering, packet processing, and local data storage without external memory for many functions.
  • I/O Count  Up to 600 I/O pins, supporting dense peripheral and high-speed interface connectivity directly from the device.
  • Transceiver-capable Series  As a Stratix V GX device, the series includes transceiver speed grades (documented up to 14.1 Gbps in the Stratix V GX family), delivering options for high-rate serial links where required by the design.
  • Package & Mounting  1152-BBGA (FCBGA) package with supplier device package listed as 1152-FBGA (35×35); surface-mount mounting for standard PCB assembly processes.
  • Power Supply  Core voltage supply range of 870 mV to 930 mV, allowing designers to plan power delivery and thermal considerations precisely.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial applications and environments within this range.
  • RoHS Compliant  Environmental compliance for lead-free manufacturing processes.

Typical Applications

  • High-performance Networking and Telecom  Leverages the Stratix V GX series transceiver capabilities and large logic/memory resources for packet processing, line cards, and protocol bridging.
  • Data Center Acceleration  Large logic capacity and embedded RAM support compute offload, custom acceleration, and aggregation functions in rack or appliance designs.
  • DSP and Signal Processing  Extensive logic elements and on-chip memory enable implementation of complex DSP chains, filtering, and real-time data paths.
  • Complex System Prototyping  High I/O count and dense logic make the device well suited for prototyping SoC components, custom IP integration, and hardware validation platforms.

Unique Advantages

  • High Logic Density:  Approximately 340,000 logic elements reduce the need for multi‑device partitioning and simplify board-level design.
  • Substantial On-chip Memory:  Approximately 19.46 Mbits of embedded RAM provides local storage for buffering, state machines, and temporary datasets without immediate external memory dependency.
  • Extensive I/O Count:  600 I/Os enable direct connection to numerous peripherals, parallel interfaces, and high-bandwidth buses.
  • Flexible Packaging:  1152-BBGA FCBGA surface-mount package supports compact, high-density PCB layouts for space-constrained systems.
  • Commercial-grade Operating Range:  0 °C to 85 °C rating aligns with mainstream embedded and communications equipment temperature requirements.
  • Regulatory Compliance:  RoHS compliance supports lead-free manufacturing and global production requirements.

Why Choose 5SGXMA3H1F35C1G?

The 5SGXMA3H1F35C1G brings Stratix V GX series capabilities into a high-density FPGA package suited for commercial applications that require a balance of logic capacity, embedded memory, and extensive I/O. Its combination of approximately 340,000 logic elements, roughly 19.46 Mbits of on‑chip RAM, and 600 I/Os makes it a practical choice for designers building complex networking, signal processing, or acceleration systems.

For teams focused on scalable, high-performance implementations with predictable power and temperature envelopes, this FPGA offers a clear platform to integrate large custom logic blocks and high-throughput interfaces while leveraging the Stratix V family’s documented transceiver and I/O capabilities.

If you would like pricing, availability, or to request a formal quote for 5SGXMA3H1F35C1G, submit a quote request or contact sales to get detailed procurement information and lead-time guidance.

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