5SGXMA3H1F35C1G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 312 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3H1F35C1G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMA3H1F35C1G is a Stratix V GX family FPGA in a 1152-BBGA FCBGA package, optimized for high-density programmable logic and extensive I/O integration. With a large logic fabric, substantial on‑chip RAM, and support for high-speed transceiver grades in the Stratix V GX series, this commercial-grade device targets demanding digital designs that require heavy compute and high I/O counts.
Key value propositions include high logic capacity, abundant embedded memory, broad I/O availability, and commercial temperature operation for mainstream embedded and communications applications.
Key Features
- Logic Capacity Approximately 340,000 logic elements, providing capacity for large-scale digital designs and complex custom logic.
- Embedded Memory Approximately 19.46 Mbits of on-chip RAM, enabling high-bandwidth buffering, packet processing, and local data storage without external memory for many functions.
- I/O Count Up to 600 I/O pins, supporting dense peripheral and high-speed interface connectivity directly from the device.
- Transceiver-capable Series As a Stratix V GX device, the series includes transceiver speed grades (documented up to 14.1 Gbps in the Stratix V GX family), delivering options for high-rate serial links where required by the design.
- Package & Mounting 1152-BBGA (FCBGA) package with supplier device package listed as 1152-FBGA (35×35); surface-mount mounting for standard PCB assembly processes.
- Power Supply Core voltage supply range of 870 mV to 930 mV, allowing designers to plan power delivery and thermal considerations precisely.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial applications and environments within this range.
- RoHS Compliant Environmental compliance for lead-free manufacturing processes.
Typical Applications
- High-performance Networking and Telecom Leverages the Stratix V GX series transceiver capabilities and large logic/memory resources for packet processing, line cards, and protocol bridging.
- Data Center Acceleration Large logic capacity and embedded RAM support compute offload, custom acceleration, and aggregation functions in rack or appliance designs.
- DSP and Signal Processing Extensive logic elements and on-chip memory enable implementation of complex DSP chains, filtering, and real-time data paths.
- Complex System Prototyping High I/O count and dense logic make the device well suited for prototyping SoC components, custom IP integration, and hardware validation platforms.
Unique Advantages
- High Logic Density: Approximately 340,000 logic elements reduce the need for multi‑device partitioning and simplify board-level design.
- Substantial On-chip Memory: Approximately 19.46 Mbits of embedded RAM provides local storage for buffering, state machines, and temporary datasets without immediate external memory dependency.
- Extensive I/O Count: 600 I/Os enable direct connection to numerous peripherals, parallel interfaces, and high-bandwidth buses.
- Flexible Packaging: 1152-BBGA FCBGA surface-mount package supports compact, high-density PCB layouts for space-constrained systems.
- Commercial-grade Operating Range: 0 °C to 85 °C rating aligns with mainstream embedded and communications equipment temperature requirements.
- Regulatory Compliance: RoHS compliance supports lead-free manufacturing and global production requirements.
Why Choose 5SGXMA3H1F35C1G?
The 5SGXMA3H1F35C1G brings Stratix V GX series capabilities into a high-density FPGA package suited for commercial applications that require a balance of logic capacity, embedded memory, and extensive I/O. Its combination of approximately 340,000 logic elements, roughly 19.46 Mbits of on‑chip RAM, and 600 I/Os makes it a practical choice for designers building complex networking, signal processing, or acceleration systems.
For teams focused on scalable, high-performance implementations with predictable power and temperature envelopes, this FPGA offers a clear platform to integrate large custom logic blocks and high-throughput interfaces while leveraging the Stratix V family’s documented transceiver and I/O capabilities.
If you would like pricing, availability, or to request a formal quote for 5SGXMA3H1F35C1G, submit a quote request or contact sales to get detailed procurement information and lead-time guidance.

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