5SGXMA3H1F35C2G

The 5SGXMA3H1F35C2G is a Stratix® V GX field-programmable gate array (FPGA) offered in a high-density FCBGA package. It combines large programmable logic capacity and embedded memory with a high I/O count, delivered in a surface-mount 1152-BBGA (35 × 35 mm) package for compact system integration.

Designed for commercial-temperature applications, this device provides a platform for complex, custom digital logic implementations that require significant on-chip resources and a broad I/O footprint.

Key Features

• Logic Capacity  340,000 logic elements to implement large-scale custom digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive functions.
• I/O Density  600 I/Os to accommodate wide parallel interfaces and high pin-count system requirements.
• Package  1152-BBGA FCBGA (supplier device package: 1152-FBGA, 35×35 mm) optimized for surface-mount assembly and compact layouts.
• Power and Supply  Core voltage supply range of 870 mV to 930 mV for defined power-domain integration and planning.
• Mounting and Grade  Surface-mount device, commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant, supporting regulatory requirements for hazardous substances.

Typical Applications

• High-density programmable logic  Use the device’s 340,000 logic elements to implement complex custom accelerators and control logic in compact systems.
• Memory-intensive designs  Approximately 19.456 Mbits of embedded RAM enable buffering, packet processing, and stateful processing without large external memory.
• High-pin-count interfacing  600 I/Os support multi-channel connectivity, wide buses, and dense peripheral integration on a single FPGA.
• Compact board-level integration  The 1152-BBGA FCBGA package provides a high-resource FPGA in a space-efficient surface-mount form factor.

Unique Advantages

• Large programmable fabric  Enables consolidation of multiple functions into one device, reducing BOM and board complexity.
• Substantial on-chip memory  Reduces dependence on external RAM for many applications, simplifying design and improving latency.
• Extensive I/O resources  Supports broad system interfacing and parallel data paths without extensive external multiplexing.
• Commercial temperature rating  Clear operating range (0 °C to 85 °C) for mainstream embedded and enterprise applications.
• Compact, manufacturable package  1152-ball FCBGA in a 35 × 35 mm footprint supports high-density PCB designs and surface-mount production.
• Regulatory compliance  RoHS compliant to meet environmental and procurement requirements.

Why Choose 5SGXMA3H1F35C2G?

The 5SGXMA3H1F35C2G delivers a balance of high logic density, substantial embedded memory, and a large I/O count in a compact FCBGA package, making it suitable for demanding commercial applications that require significant on-chip resources. Its defined core supply range and commercial temperature rating provide clear electrical and environmental parameters for system design.

This device is appropriate for engineering teams designing integrated digital systems that need to consolidate functionality, reduce external component count, and leverage a high-density Stratix® V GX FPGA platform backed by documented device specifications.

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