5SGXMA3E3H29I4WN

The 5SGXMA3E3H29I4WN is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 780-BBGA (FCBGA) package. It provides a large programmable fabric with high I/O capacity and substantial on-chip memory for complex, logic-dense designs.

As a member of the Stratix V GX family, this device aligns with the product family options described in the datasheet, including commercial and industrial temperature grades and transceiver speed grade offerings.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large-scale digital logic and custom hardware functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffers, FIFOs, and memory-intensive accelerators.
• I/O Density  600 I/O pins to support extensive external interfacing and multi-channel connectivity.
• Package and Mounting  780-BBGA (FCBGA) supplier package (780-HBGA, 33 × 33); surface-mount package suitable for high-density PCB integration.
• Power Supply  Core voltage supply range of 820 mV to 880 mV for the device core domain.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic element count and on-chip RAM to implement complex state machines, data paths, and algorithmic accelerators.
• High-I/O interfacing and protocol aggregation  600 I/O pins provide the capacity for multi-channel I/O, bridging, and parallel peripheral connections.
• Industrial control and instrumentation  Industrial temperature rating (−40 °C to 100 °C) and RoHS compliance make the device suitable for rugged or regulated industrial environments.
• System integration and prototyping  The FCBGA 780-BBGA package and surface-mount design support compact, integrated system boards and advanced prototypes.

Unique Advantages

• Substantial programmable fabric: Approximately 340,000 logic elements enable large, integrated logic implementations without external ASIC development.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O capability: 600 I/O pins support complex interfacing requirements and system-level connectivity.
• Industrial-grade thermal range: Rated for −40 °C to 100 °C operation, supporting deployment in temperature-challenging environments.
• Compact, surface-mount package: 780-BBGA (33 × 33) package enables high-density board layouts and integration into space-constrained systems.
• Standards-aligned compliance: RoHS compliance supports environmental and regulatory requirements for electronic assemblies.

Why Choose 5SGXMA3E3H29I4WN?

The 5SGXMA3E3H29I4WN delivers a combination of extensive logic resources, substantial on-chip memory, and high I/O capacity in a compact 780-BBGA surface-mount package. Its industrial operating range and RoHS compliance make it suitable for designs that require robust environmental performance and regulatory alignment.

This device is well suited for engineers and system designers who need a highly integrated FPGA platform capable of implementing large digital systems, complex interfacing, and memory-intensive logic while maintaining a compact board footprint and industrial temperature tolerance.

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