5SGXMA3H1F35C1N

The 5SGXMA3H1F35C1N is a Stratix® V GX family field programmable gate array (FPGA) IC from Intel, delivering high-density programmable logic in a surface-mount FCBGA package. This device combines a large logic fabric, significant on-chip memory, and extensive I/O capability for complex digital designs.

Targeted at applications that require substantial logic capacity and broad I/O connectivity, the part offers a balance of integration and power efficiency through a low core voltage range. It is provided in a commercial temperature grade and is RoHS compliant.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement complex digital functions and large-scale programmable logic architectures.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM, enabling data buffering, memory-mapped logic, and state storage directly within the device.
• I/O Density  600 general-purpose I/Os to support wide parallel interfaces, board-level connectivity, and dense system integration.
• Power and Core Voltage  Rated supply voltage range of 870 mV to 930 mV for the device core.
• Package and Mounting  1152‑BBGA FCBGA packaging; supplier device package listed as 1152‑FBGA (35×35). Surface-mount mounting type for standard PCB assembly.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.
• Stratix V GX Series-Level Characteristics  Stratix V GX devices are described in the series datasheet with transceiver and speed-grade information (series-level specifications apply to the Stratix V GX family).

Typical Applications

• High‑density digital processing  Use the large logic element pool and on-chip RAM to implement complex signal processing, data-path pipelines, and custom accelerators.
• High‑I/O systems  With 600 I/Os, the device is suited for systems that require many parallel interfaces, aggregation of multiple peripherals, or dense board-level connectivity.
• Prototyping and custom SoC integration  Ample logic and embedded memory enable integration of custom peripherals, interface bridges, and prototype SoC functions on a single device.

Unique Advantages

• High logic density: The approximately 340,000 logic elements enable implementation of large logic functions and multi-module designs without partitioning across multiple devices.
• Substantial on‑chip RAM: Approximately 19.456 Mbits of embedded memory reduce external memory dependence and improve data throughput for latency-sensitive operations.
• Extensive I/O count: 600 I/Os provide flexibility for interfacing with multiple subsystems or high-channel-count designs, simplifying board-level routing.
• Compact surface‑mount package: The 1152‑FBGA/BBGA FCBGA package supports high pin-count integration in space-constrained PCBs and standard SMT assembly flows.
• Low core voltage operation: The 870 mV–930 mV supply range supports low-voltage core operation for power-optimized designs.
• Commercial temperature grade: Rated for 0 °C to 85 °C for use in typical commercial environments.

Why Choose 5SGXMA3H1F35C1N?

The 5SGXMA3H1F35C1N positions itself as a high-density Stratix V GX FPGA option from Intel, combining a large logic fabric, significant embedded memory, and extensive I/O capacity in a single surface‑mount FCBGA package. These attributes make it appropriate for designs that require consolidated programmable logic, on-chip data storage, and broad connectivity within a commercial temperature envelope.

For engineers and procurement teams designing advanced digital systems, this device offers a balance of integration and electrical characteristics—supporting complex implementations while maintaining a compact board footprint and RoHS compliance.

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