5SGXMA3H1F35C1WN

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA

Quantity 116 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3H1F35C1WN – Stratix® V GX FPGA, 340,000 logic elements, 1152‑BBGA

The 5SGXMA3H1F35C1WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering very-high logic capacity and extensive I/O in a compact FCBGA package. The device provides 340,000 logic elements and approximately 19.5 Mbits of embedded memory with up to 600 I/Os, making it suitable for demanding, high-density commercial FPGA implementations.

This surface-mount, commercial-grade FPGA is specified for operation from 0 °C to 85 °C, with a core supply range of 870 mV to 930 mV, and is RoHS compliant.

Key Features

  • Core Capacity  340,000 logic elements for large-scale logic integration and complex designs.
  • Embedded Memory  Approximately 19.5 Mbits of on-chip RAM to support buffering, data storage, and memory-intensive functions.
  • I/O Density  Up to 600 general-purpose I/Os to enable extensive external connectivity and peripheral interfacing.
  • Package & Mounting  1152‑BBGA (FCBGA) supplier package, 1152‑FBGA (35×35) footprint, surface‑mount for high-density board designs.
  • Power  Core voltage supply specified between 870 mV and 930 mV for precise power routing and regulator selection.
  • Operating Range & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
  • Regulatory Compliance  RoHS compliant, supporting material compliance requirements for commercial electronics.

Unique Advantages

  • High logic integration: 340,000 logic elements enable consolidation of large or multiple functions into a single FPGA, reducing board-level component count.
  • Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM supports data buffering and local storage to lower external memory dependency.
  • Extensive I/O capability: Up to 600 I/Os provide flexibility for interfacing many peripherals, high-pin-count connectors, or parallel buses.
  • Space-efficient package: 1152‑BBGA (35×35) FCBGA packaging balances high pin count with a compact board footprint for dense systems.
  • Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliance to meet standard commercial deployment requirements.
  • Predictable power planning: Defined core supply range of 870–930 mV simplifies regulator selection and power-supply design.

Why Choose 5SGXMA3H1F35C1WN?

The 5SGXMA3H1F35C1WN delivers a combination of very high logic capacity, substantial embedded memory, and broad I/O count in an industry-standard FCBGA package. These attributes make it well suited for commercial designs that require large-scale programmable logic and significant on-chip resources while maintaining a compact board footprint.

Its commercial-grade operating range, defined core voltage window, and RoHS compliance provide predictable integration and material compatibility for long-term product deployment and supply-chain planning.

Request a quote or submit an availability inquiry to get pricing, lead-time, and ordering information for the 5SGXMA3H1F35C1WN.

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