5SGXMA3H1F35C1WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 116 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3H1F35C1WN – Stratix® V GX FPGA, 340,000 logic elements, 1152‑BBGA
The 5SGXMA3H1F35C1WN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering very-high logic capacity and extensive I/O in a compact FCBGA package. The device provides 340,000 logic elements and approximately 19.5 Mbits of embedded memory with up to 600 I/Os, making it suitable for demanding, high-density commercial FPGA implementations.
This surface-mount, commercial-grade FPGA is specified for operation from 0 °C to 85 °C, with a core supply range of 870 mV to 930 mV, and is RoHS compliant.
Key Features
- Core Capacity 340,000 logic elements for large-scale logic integration and complex designs.
- Embedded Memory Approximately 19.5 Mbits of on-chip RAM to support buffering, data storage, and memory-intensive functions.
- I/O Density Up to 600 general-purpose I/Os to enable extensive external connectivity and peripheral interfacing.
- Package & Mounting 1152‑BBGA (FCBGA) supplier package, 1152‑FBGA (35×35) footprint, surface‑mount for high-density board designs.
- Power Core voltage supply specified between 870 mV and 930 mV for precise power routing and regulator selection.
- Operating Range & Grade Commercial grade device rated for operation from 0 °C to 85 °C.
- Regulatory Compliance RoHS compliant, supporting material compliance requirements for commercial electronics.
Unique Advantages
- High logic integration: 340,000 logic elements enable consolidation of large or multiple functions into a single FPGA, reducing board-level component count.
- Substantial on-chip memory: Approximately 19.5 Mbits of embedded RAM supports data buffering and local storage to lower external memory dependency.
- Extensive I/O capability: Up to 600 I/Os provide flexibility for interfacing many peripherals, high-pin-count connectors, or parallel buses.
- Space-efficient package: 1152‑BBGA (35×35) FCBGA packaging balances high pin count with a compact board footprint for dense systems.
- Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliance to meet standard commercial deployment requirements.
- Predictable power planning: Defined core supply range of 870–930 mV simplifies regulator selection and power-supply design.
Why Choose 5SGXMA3H1F35C1WN?
The 5SGXMA3H1F35C1WN delivers a combination of very high logic capacity, substantial embedded memory, and broad I/O count in an industry-standard FCBGA package. These attributes make it well suited for commercial designs that require large-scale programmable logic and significant on-chip resources while maintaining a compact board footprint.
Its commercial-grade operating range, defined core voltage window, and RoHS compliance provide predictable integration and material compatibility for long-term product deployment and supply-chain planning.
Request a quote or submit an availability inquiry to get pricing, lead-time, and ordering information for the 5SGXMA3H1F35C1WN.

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