5SGXMA3H1F35C2N

The 5SGXMA3H1F35C2N is an Intel Stratix V GX family FPGA in a 1152-ball FCBGA package designed for high-density programmable logic applications. It integrates a large logic fabric, substantial on-chip memory, and high I/O count to address demanding communications, data processing, and signal-processing designs.

Key device attributes include approximately 340,000 logic elements, about 19.456 Mbits of embedded memory, 600 I/O pins, and a low core supply range of 0.870–0.930 V. The device is offered in a commercial temperature grade with an operating range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 340,000 logic elements implemented across 128,300 logic array blocks for complex programmable logic and custom datapath implementations.
• On‑Chip Memory  Approximately 19.456 Mbits of embedded memory to support buffering, FIFOs, and on-chip data storage for high-throughput designs.
• I/O Capacity  Up to 600 I/O pins to support dense peripheral interfacing and wide parallel buses.
• Power and Supply  Core voltage supply range of 0.870 V to 0.930 V for the device core domains.
• Package & Mounting  1152-ball BGA FCBGA package (1152‑FBGA, 35 × 35 mm supply package) with surface-mount mounting for high-density board integration.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant.

Typical Applications

• High‑speed communications  Use the Stratix V GX device where dense logic, large on-chip memory, and extensive I/O are needed for packet processing, protocol bridging, and high-throughput link aggregation.
• Signal processing and instrumentation  Implement real-time DSP pipelines, data acquisition front-ends, and FPGA-based signal conditioning leveraging the device’s logic capacity and embedded RAM.
• Compute acceleration  Offload custom compute kernels and hardware accelerators where wide parallelism and on-chip buffering reduce latency and improve throughput.
• Prototyping and platform development  Develop and validate complex system architectures requiring significant programmable logic and numerous I/Os for peripheral and mezzanine connectivity.

Unique Advantages

• High logical density: The combination of ~340,000 logic elements and 128,300 logic array blocks enables implementation of large, system‑level designs on a single device.
• Significant embedded memory: Approximately 19.456 Mbits of on‑chip RAM reduces external memory dependency for buffering and state storage.
• Extensive I/O bandwidth: 600 I/O pins provide flexibility for multi-channel interfaces, wide buses, and high-pin-count peripherals.
• Compact, manufacturable package: 1152-ball FCBGA in a 35 × 35 mm footprint supports high-density board layouts and surface-mount assembly.
• Low-voltage core operation: 0.870–0.930 V core supply supports optimized power domain design for modern FPGA systems.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation to meet standard commercial environment requirements.

Why Choose 5SGXMA3H1F35C2N?

The 5SGXMA3H1F35C2N positions itself as a high-density Stratix V GX FPGA option for designers who require large programmable logic capacity, substantial embedded memory, and a high number of I/Os in a compact BGA package. Its core supply range and commercial temperature rating make it suitable for demanding commercial applications where integration and on-chip resources reduce system complexity.

Backed by the Stratix V device family documentation, this FPGA is appropriate for development teams targeting advanced communications, signal processing, and compute-acceleration designs that benefit from a single, highly integrated programmable device.

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