5SGXMA3H1F35C2WN

The 5SGXMA3H1F35C2WN is a Stratix® V GX field programmable gate array (FPGA) in a 1152-ball FCBGA package designed for high-density, configurable logic implementations. It provides a large combinational and sequential fabric alongside substantial on-chip RAM and a high I/O count for complex system integration.

Targeted at commercial-grade designs, this device balances large logic capacity and embedded memory with a low-voltage core supply (870 mV–930 mV) and a surface-mount 1152-FBGA (35×35) package for board-level deployment within a 0 °C to 85 °C operating window.

Key Features

• Core Logic  340,000 logic elements provide substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive functions.
• I/O Density  600 programmable I/Os enable broad external connectivity for high-channel-count interfaces and parallel data paths.
• Power  Core voltage supply range of 870 mV to 930 mV for the device core power domain.
• Package & Mounting  1152-ball BGA, supplier package 1152-FBGA (35×35); surface-mount construction suitable for standard PCB assembly.
• Temperature & Grade  Commercial grade with specified operating temperature from 0 °C to 85 °C.
• Compliance  RoHS compliant to support environmental and regulatory requirements for lead-free assembly.
• Documentation  Full Stratix V device datasheet available for detailed electrical and switching characteristics.

Typical Applications

• High-density digital systems  Use the large logic element count and embedded RAM to implement complex processing pipelines and custom accelerators.
• Multi-channel I/O systems  Leverage 600 I/Os for designs requiring extensive parallel interfaces or high channel counts.
• Memory-intensive functions  Deploy the on-chip RAM for buffering, lookup tables, and state machines within embedded architectures.

Unique Advantages

• Substantial programmable capacity: 340,000 logic elements enable highly integrated custom logic and system consolidation on a single device.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces dependence on external memory for many designs.
• High I/O scalability: 600 I/Os support broad interfacing options and simplify board-level routing for multi-channel systems.
• Compact board footprint: 1152-FBGA (35×35) package provides high pin count in a compact surface-mount form factor for dense PCBs.
• Commercial deployment ready: Commercial temperature grade and RoHS compliance make this device suitable for standard commercial product lifecycles.
• Defined low-voltage core: A narrow core supply range (870 mV–930 mV) supports power budgeting and consistent electrical integration.

Why Choose 5SGXMA3H1F35C2WN?

The 5SGXMA3H1F35C2WN offers a balanced combination of large logic capacity, substantial on-chip RAM, and a high I/O count in a compact 1152-FBGA package, making it well suited for commercial designs that require dense, configurable logic and extensive external connectivity. Its defined electrical and thermal characteristics simplify system-level power and thermal planning.

Choose this Stratix V GX device when you need a high-capacity FPGA platform for complex digital processing, multi-channel interfacing, or designs that benefit from integrated memory and a high pin-count package backed by full device documentation.

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