5SGXMA3H1F35C2LN

The 5SGXMA3H1F35C2LN is a Stratix V GX field programmable gate array (FPGA) in a 1152-BBGA (35×35) FCBGA package. It provides a large logic fabric with substantial embedded RAM and a high count of I/O, suitable for complex digital designs that require significant on-chip resources and high pin density.

Key attributes of this device include approximately 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 user I/Os. The device is supplied for commercial-grade operation with a core supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large-scale custom logic, datapaths, and control functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• I/O Density  600 user I/Os to interface with high-pin-count peripherals, parallel buses, and board-level routing requirements.
• Package & Mounting  1152-BBGA (35×35) FCBGA footprint with surface-mount mounting for high-density board integration.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV for core power planning and regulator selection.
• Operating Grade & Temperature  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• RoHS Compliance  RoHS-compliant device to meet common environmental requirements.

Typical Applications

• High-density digital processing  Large logic capacity and substantial embedded RAM make this FPGA suitable for complex custom datapaths and packet processing engines.
• Communications and interfaces  High I/O count supports multi-lane interfaces, wide parallel buses, and board-level I/O aggregation.
• Prototyping and system integration  The device’s large resource set is well suited to proof-of-concept builds and integrating multiple IP blocks on a single device.

Unique Advantages

• Large on-chip resource set:  Approximately 340,000 logic elements and roughly 19.456 Mbits of embedded RAM reduce the need for external logic and memory, simplifying system BOM.
• High I/O capacity:  600 user I/Os enable direct connectivity to a wide range of peripherals and high-bandwidth interfaces without extensive external multiplexing.
• Commercial-grade thermal window:  Specified operation from 0 °C to 85 °C aligns with many commercial system environments and deployment scenarios.
• BGA packaging for dense boards:  1152-BBGA (35×35) FCBGA packaging supports compact, high-density PCB layouts and reliable surface-mount assembly.
• Controlled core power requirements:  A defined core voltage range (820 mV–880 mV) simplifies regulator selection and power budgeting in system design.
• Regulatory alignment:  RoHS compliance helps meet common environmental and manufacturing standards.

Why Choose 5SGXMA3H1F35C2LN?

The 5SGXMA3H1F35C2LN delivers a compelling combination of large logic capacity, significant on-chip memory, and high I/O count in a compact 1152-BBGA package. It is targeted at designs that require substantial programmable resources and dense board-level integration while operating within commercial temperature limits.

Designers and system integrators seeking to consolidate multiple functions onto a single FPGA or to implement complex custom hardware logic will find the device’s resource set and package profile well matched to demanding digital and interface-centric applications. RoHS compliance and defined electrical parameters help streamline qualification and production planning.

Request a quote or submit an inquiry to learn about availability, lead times, and volume pricing for the 5SGXMA3H1F35C2LN. Our team can assist with part-level information and procurement support.